Technical Library: 10

SMT Offline X-Ray System - Ensuring Component Integrity

Technical Library | 2023-09-15 11:17:10.0

Ensure the integrity of your components with our SMT Offline X-Ray System. Detect hidden defects and improve the quality of your PCBAs with precise X-ray inspection technology.

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

Considerations in Dispensing Conformal Coatings

Technical Library | 1999-08-27 09:27:10.0

Conformal coating is a material that is applied to electronic products or assemblies to protect them from solvents, moisture, dust or other contaminants that may cause harm. Coating also prevents dendrite growth, which may result in product failure. This paper will discuss the variables that affect the application of conformal coatings, and review in detail those variables that impact the process of selective coating of printed circuit boards.

ASYMTEK Products | Nordson Electronics Solutions

Micro-Sectioning of PCBs for Failure Analysis

Technical Library | 2010-01-13 12:34:10.0

Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.

BEST Inc.

SMT Line or Manual PCB Assembly? When Hand Assembly Makes Sense

Technical Library | 2017-12-29 22:38:10.0

Although PCB assembly is a highly automated process, there are times when manual PCB assembly makes sense for prototyping innovative tech products.

Power Design Services

Virtual Access Technique Augments Test Coverage on Limited Access PCB Assemblies

Technical Library | 2012-05-03 20:40:10.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Increased pressures to reduce time to market and time to volume have forced many manufacturers of populated printed circuit boards to rely on capacitively coupled, un-powered, vec

Teradyne

The Surface Finish Effect on the Creep Corrosion in PCB

Technical Library | 2012-05-10 19:48:10.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Creep corrosion normally happens in the end system, PCB, connectors and components are widely noted due to the exposure of high sulfur environments under elevated humidity. In thi

Integrated Service Technology (IST)

Customer Service Improvement: It's Mission Critical To Your Future

Technical Library | 2001-05-23 16:34:10.0

Consultant R. Michael Donovan asks, "Do you really provide what your customers want and need?" He contends that companies who continuously excel at customer service will gain more marketshare. Mike provides his reader with 10 questions that can help an organization assess its customer service performance, progress and opportunities for improvement.

R. Michael Donovan & Co., Inc.

Large Thin Organic PTFE Substrates for Multichip Applications

Technical Library | 2007-06-13 13:44:10.0

Very high performance computer applications have created a demand for large organic substrates capable of interconnecting one or a few ASIC semiconductor devices with packaged memory devices. The electrical advantages offered by the use of a thin PTFE composite substrate were coupled with intrinsic mechanical advantages to create very high performance applications. The application development required interactions of design, fabrication, and new manufacturing technology to obtain rapid prototype production and allow a successful ensuing manufacturing ramp.

i3 Electronics

Controlling Copper Build Up in Automatic Soldering Equipment Using Lead-Free Solder

Technical Library | 2008-11-20 00:46:10.0

The Sn/Ag/Cu family of alloys is the leading candidate for a lead-free alternative. The first part of this study was to determine if there is any significant difference between Sn/Ag/Cu alloys when used in automatic soldering equipment in terms of copper build-up in the system. The study compared two Sn/Ag/Cu alloys to determine if at processing temperatures one alloy would absorb less copper than the other alloy.

AIM Solder

Anisotropic Conductive Adhesive Bonding - A High Quality Interconnection Technique

Technical Library | 2011-09-08 13:46:10.0

Anisotropic Conductive Adhesive Bonding is an interconnection technique mostly used for connecting displays to pcb’s using anisotropic conductive adhesive and flex foils. For successful implementation there are a few basic constraints. If these are followed, display connection is a simple and reliable process, giving top quality connections. Heat-Sealing can be done in any factory and can be introduced in a few months, from start of design to mass productions

MIYACHI EUROPE GmbH


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