Technical Library: 10-25 (Page 1 of 1)

Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate

Technical Library | 2007-10-25 18:39:07.0

More and more substrate designs require signals paths that can handle multi-gigahertz frequencies [1-3]. The challenges for organic substrates, in meeting these electrical requirements, include using high-speed, low-loss materials, manufacturing precise structures and making a reliable finished product. A new substrate technology is presented that addresses these challenges.

i3 Electronics

Stencil Printing of Small Apertures

Technical Library | 2012-10-25 16:34:02.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. This paper will examine stencil technologies (including Laser and Electroform), Aperture Wall coatings (including Nickel-Teflon coatings and Nano-coatings), and how these parameters influence paste transfer for miniature devices with Area Ratios less than the standard recommended lower limit of .5. A matrix of print tests will be utilized to compare paste transfer and measure the effectiveness of the different stencil configurations. Area Ratios ranging from .32 to .68 will be investigated.

Photo Stencil LLC

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