Technical Library | 2024-08-27 06:17:52.0
销售经理 电子邮件 WhatsApp Skype 乌娜 sales5@mooreplc.com 86-15359408275 +8615359408275 品牌/制造商： ◤ PU515A 3BSE032401R1 ◥ PU515A 的特性： MB300 双运河：使用 MB300 协议进行通信的运河，可能会连接到其他控制系统。 密码：PU515A 的最终目的是实现 PU515、PU518 或 PU519 的前模型。 由于 USB 端口：RTA 与其他表的区别，PU515A 不包括 USB 端口。 为什么选择我们 1.100％原装产品，100％质量保证，价格更具竞争力。 如果您发现假货，请立即联系我们！我们承担运费！我们将免费为您寄送新产品！ 2.周到的服务 专业的售后服务。 3. 快速发货 我们有大量库存，可以立即发货。 推荐型号 本利内华达 330500-01-04 普罗软件 MVI94-MCM 本利内华达 330780-50-00 霍尼韦尔 05701-A-0301 本利内华达 330104-00-06-10-02-00 霍尼韦尔 FC-电源-UNI2450U 本利内华达 9571-50 普罗软件 MVI46-MNET 本利内华达 177230-00-01-05 霍尼韦尔 05704-A-0135 本利内华达 330180-51-CN ICS T8110B 通用电气 IC697ACC701 伍德沃德 8273-1011 本利内华达 136188-02 ABB HIEE300867R0001 PPB022 DE01 通用电气 IC695ETM001 特利科奈斯 3603E 易宝 PR6424/000-030 CON021 霍尼韦尔 51198685-100 SPS5710-2-LF 霍尼韦尔 CC-TUIO31 51306875-176 通用电气 DS200PTCTG1BAA 福克斯堡 FBM201 P0914SQ 通用电气 UR8LH 通用电气 IS210HSLAH1ADE 霍尼韦尔 CC-PAIH02 51405038-375 霍尼韦尔 51198947-100F 易宝 PR9268/200-000
Technical Library | 2006-10-02 14:26:47.0
This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP) on .062" immersion Ag plated printed circuit boards (PCB) using Pb-free solder paste. Four different leadless CSP designs were studied and each was evaluated using multiple PCB attachment pad designs.
Technical Library | 2007-10-02 22:09:50.0
The vast majority (99%) of the electronics market in North America is composed of products produced for commercial applications. The 1% share of the electronics market driven by Department of Defense (DoD) applications has created a niche market for RF qualified devices. The DoD, with its emphasis on COTS (Commercial Off The Shelf) and "Open" systems, is beginning to become more interested in using commercially oriented RF devices for military applications as a means to leverage the volumes and innovations of the commercial world.
Technical Library | 2014-10-02 20:10:07.0
Sn3.0Ag0.5Cu (SAC305) is the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years, the price of silver has dramatically increased driving a desire for lower silver alloy alternatives. As the results, there is a significant increase in the number of alternative low/no silver lead-free solder alloys available in the industry recently.In this paper, we'll present the performance and process capability of various low/no silver alloy solder pastes. Data from printability, wetting test, slump test, solder ball test, voiding, etc… will be discussed and compared with the control SAC305 solder paste. Benefits and concerns of using low/no silver alloy solder paste materials will also be addressed.
Technical Library | 2023-10-09 16:10:02.0
This document provides high-level PCB design, sensor mounting, and handling guidelines for TDK IMU devices, which incorporate a combination of gyroscopes and accelerometers. Each sensor has specific requirements to ensure the highest performance in a finished product. For a layout assessment of your design, including placement and estimated temperature disturbances, please contact TDK. The TDK IMU devices discussed in this document (ICM-40607x, ICM-40608, ICM-42xxx, ICM-43xxx, and ICM-45xxx products) consist of 3-axis MEMS gyroscopes and 3-axis MEMS accelerometers.
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