Technical Library: 11.0 (Page 1 of 4)

Computer Aided Design, Manufacturing, and Engineering

Technical Library | 2019-07-01 10:44:11.0

In the electronics industry of today, companies emphasize better quality, lower cost, and shorter lead time on their products in order to keep up with their competitors. ACI Technologies (ACI) has been utilizing Computer Aided Design (CAD), Computer Aided Manufacturing(CAM), and Computer Aided Engineering (CAE) in its development of advanced electronics systems. CAD utilizes computer systems to assist in the creation, modification, analysis, and optimization of a design [1].

ACI Technologies, Inc.

Backplane Architecture High-Level Design

Technical Library | 2011-03-16 20:09:11.0

The backplane is the key component in any system architecture. The sooner one considers the backplane’s physical architecture near the beginning of a project, the more successful the project will be. This white paper introduces the concept of a backplane

Lamsim Enterprises Inc.

Developments in Fine Line Resist Stripping

Technical Library | 2011-07-14 17:47:11.0

In this paper, the concept for the next generation of resist stripper solutions is introduced, with specific emphasis upon development of new solutions targeted at the ever demanding fine line applications. The novel formulation used minimises the initial

Atotech

1CLICKSMT Odd form Component inserting System -- Solution for security products assembly

Technical Library | 2020-04-29 03:25:11.0

1CLICKSMT has recently installed a odd form component inserting and wave soldering line for a security products manufacturer.

1 CLICK SMT TECHNOLOGY CO., Limited

Improve Crimp Quality to Increase Productivity

Technical Library | 2015-08-17 09:07:11.0

Since a high percentage of product failures can be traced to poor electrical connections, crimp quality is of paramount importance. There are many factors that come into play that affect crimp quality and knowing the relevant factors, and to what extent each factor affects the end result, will help to guide the process engineer towards achieving the best possible results.

Schleuniger, Inc.

Embedded Fibers Enhance Nano-Scale Interconnections

Technical Library | 2015-09-03 18:06:11.0

While the density of chip-to-chip and chip-to-package component interconnections increases and their size decreases the ease of manufacture and the interconnection reliability are being reduced. This paper will introduce the use of embedded fibers in the interconnections as a means of addressing these issues.

Smoltek AB

What is UV weathering test chamber

Technical Library | 2019-06-10 22:14:11.0

UV-Lamp Weathering Test Chamber takes fluorescent UV lamps as light source to simulate the UV irradiation in natural light and condensation to conduct accelerated weathering test on the materials, It simulates UV, rain, high temperature, humidity, condensation, darkness and other environmental conditions, combine them together, and carry them out automatically.

Symor Instrument Equipment Co.,Ltd

How to optimize dispensing processes

Technical Library | 2022-10-13 13:02:11.0

Effective and reliable dispensing is based primarily on process technology that has been perfectly set up for the specific project. Anyone tasked with planning dispensing systems and responsible for the processes should know the principles and key factors involved so that the dispensing processes can be successfully implemented in cooperation with system and material partners. This White Paper explains the relevant aspects of process technology and provides valuable practical tips.

Scheugenpflug Inc.

21st Century Semiconductor Manufacturing Capabilities

Technical Library | 1999-05-06 14:44:11.0

Semiconductor device manufacturers face many difficult challenges as we enter the 21st century. Some are direct consequences of adherence to Gordon Moore's Law, which states that device complexity doubles about every 18 months. Feature size reduction, increased wafer diameter, increased chip size, ultra-clean processing, and defect reduction among others are manifestations that have a direct bearing on the cost and quality of products, factory flexibility in responding to changing technology or business conditions, and on the timelines of product delivery to the ultimate customer.

Intel Corporation

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