Technical Library: 15-0 (Page 1 of 3)

BGA Rework. A Comparative Study of Selective Solder Paste Deposition For Area Array Packages

Technical Library | 2007-02-01 09:57:15.0

The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture.

BEST Inc.

Pb-free solders: Comparison of different geometrical models in calculating of enthalpy of mixing of In-Sn-Zn ternary system.

Technical Library | 2014-05-22 17:10:37.0

In this paper, the general solution model of Chou has been used to predict the integral enthalpies of mixing of liquid In-Sn-Zn ternary alloys in five selected sections, xIn/xSn = 0.15/0.85, 0.34/0.66, 0.50/0.50, 0.67/0.33 and 0.85/0.15. The other traditional models such as Kohler, Muggianu, Toop and Hillert are also included in calculations. Comparison with literature data was done and showed reasonable agreement with Toop and Hillert asymmetric models.

Université Mohammed V-Agdal

three knives led strips cutting machine

Technical Library | 2019-05-13 04:05:15.0

For the customers of LED lamp industry, LED board splitter is indispensable. Our machine is cheap, light weight and cutting speed is 500 mm per second. email:s1@hk-yush.com

YUSH Electronic Technology Co.,Ltd

Medical Device Laser Cutting: Applications

Technical Library | 2024-06-03 16:03:15.0

How Laser cutting can support medical electronics singulation of PCB and for medical components.

A-Laser, Inc.

The CAMM2 Journey and Future Potential

Technical Library | 2024-07-30 19:18:15.0

The CAMM2 Journey and Future Potential • A short history of the CAMM2 journey since 2020 • Details on LPDDR5 CAMM2 and DDR5 CAMM2 • The future work and potential of CAMM2

JEDEC Solid State Technology Association

Recommendations for Installing Flash LEDs on Flex Circuits

Technical Library | 2009-12-09 19:47:15.0

For the mobile market some PCB assemblies have been converted to flex circuit assemblies, in part because flex circuit assembly can be twisted or bent per the application needs. Flex circuits offer the same advantages as conventional printed circuit boards: quality, reliability, and high density.

Avago Technologies

3D ICs With TSVs - Design Challenges And Requirements

Technical Library | 2010-12-09 20:26:15.0

As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design teams are looking up – to 3D ICs with through-silicon vias (TSVs). 3D ICs promise “more than Moore” integration by packing a great deal of functionality int

Cadence Design Systems, Inc.

Practical Fiber Weave Effect Modeling

Technical Library | 2011-03-16 20:05:15.0

Fiber weave effect is becoming more of an issue as bit rates continue to sore upwards to 5GB/s and beyond. Due to the non-homogenous nature of printed circuit board laminates, the fiberglass weave pattern causes signals to propagate at different speeds wi

Lamsim Enterprises Inc.

Maximize Test Coverage While Optimizing Costs

Technical Library | 2013-05-10 18:12:15.0

In today’s manufacturing environments, optimizing manufacturing costs and, especially Test and Inspection costs are high on most company’s agendas. Resources are tight and many employees have multiple roles to fulfill across the whole manufacturing line so, time is limited. Test suppliers need to provide a suite of tools to ensure the highest level of quality for customer shipments.

Digitaltest Inc.

Cable and Harness Manufacturing: Five Qs to ask when selecting a Cable and Harness Tester ...

Technical Library | 2016-03-25 09:38:15.0

Ready to purchase a new tester? Interested in improving productivity & quality? Ask these technical questions of your potential supplier.

CAMI Research Inc.

  1 2 3 Next

15-0 searches for Companies, Equipment, Machines, Suppliers & Information