Technical Library | 2021-11-10 19:59:15.0
The automatic stencil wiper - first line of defense * The Printing process and why we need to focus on the wiping function * Frequency of wiping * Wiping options * Wiper profiles • Event driven wiping * Advanced options * Materials – Paper * Materials – Solvent * Preventive maintenance * Random stuff
Technical Library | 2019-06-21 10:39:15.0
Recently, an ACI Technologies (ACI) customer called to discuss failures that they had observed with some through-hole capacitor parts. The components were experiencing failures following vibration and accelerated stress testing. Upon receipt of the samples, ACI performed three levels of inspection and Energy Dispersive Spectroscopy (EDS) testing to investigate the root cause of the failures. These analyses enabled ACI to verify the elements comprising the solder joints and make the following recommendations in order to prevent future occurrences. The first inspection was to investigate the capacitor leads using optical microscopy, and no anomalies were found that could indicate bad parts from the vendor or improper handling prior to assembly. However, vertical fill in the barrel of the plated through-holes was too close to the IPC-A-610 minimum specification of 75% to determine a pass/fail condition, and therefore required further investigation.
Technical Library | 2007-02-01 09:57:15.0
The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture.
Technical Library | 2014-05-22 17:10:37.0
In this paper, the general solution model of Chou has been used to predict the integral enthalpies of mixing of liquid In-Sn-Zn ternary alloys in five selected sections, xIn/xSn = 0.15/0.85, 0.34/0.66, 0.50/0.50, 0.67/0.33 and 0.85/0.15. The other traditional models such as Kohler, Muggianu, Toop and Hillert are also included in calculations. Comparison with literature data was done and showed reasonable agreement with Toop and Hillert asymmetric models.
Technical Library | 2019-05-13 04:05:15.0
For the customers of LED lamp industry, LED board splitter is indispensable. Our machine is cheap, light weight and cutting speed is 500 mm per second. email:s1@hk-yush.com
Technical Library | 2009-12-09 19:47:15.0
For the mobile market some PCB assemblies have been converted to flex circuit assemblies, in part because flex circuit assembly can be twisted or bent per the application needs. Flex circuits offer the same advantages as conventional printed circuit boards: quality, reliability, and high density.
Technical Library | 2010-12-09 20:26:15.0
As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design teams are looking up – to 3D ICs with through-silicon vias (TSVs). 3D ICs promise “more than Moore” integration by packing a great deal of functionality int
Technical Library | 2011-03-16 20:05:15.0
Fiber weave effect is becoming more of an issue as bit rates continue to sore upwards to 5GB/s and beyond. Due to the non-homogenous nature of printed circuit board laminates, the fiberglass weave pattern causes signals to propagate at different speeds wi
Technical Library | 2013-05-10 18:12:15.0
In today’s manufacturing environments, optimizing manufacturing costs and, especially Test and Inspection costs are high on most company’s agendas. Resources are tight and many employees have multiple roles to fulfill across the whole manufacturing line so, time is limited. Test suppliers need to provide a suite of tools to ensure the highest level of quality for customer shipments.
Technical Library | 2016-03-25 09:38:15.0
Ready to purchase a new tester? Interested in improving productivity & quality? Ask these technical questions of your potential supplier.
