Technical Library | 2023-08-16 18:25:16.0
In one of our Consumer Electronics projects, a leader of networking technologies requested to test dispensing performance of a thermally conductive material, Fujipoly Sarcon SPG-50A. This material improves heat dissipation for higher frequency applications and reduces the negative effects of thermal resistance under heat, cold, humid, and thermal shock conditions. The customer's goal was to dispense a 1mm diameter dot with acceptable speed and consistency.
Technical Library | 2023-09-13 13:07:16.0
Pneumatic stencil cleaning machines are a great way to improve the efficiency and effectiveness of your stencil cleaning process. These machines use compressed air to remove contaminants and debris from stencils, which can cause defects and reliability issues.
Technical Library | 2024-07-15 09:00:16.0
Curious about setting up a state-of-the-art LED production line from 0 to 1? I.C.T recently deployed two of our top engineers to Tajikistan, where they successfully installed and trained a major client on three SMT lines, a fully SMT production line, a LED Lens production line, a PCBA coating line, and a fully automated LED bulb assembly line. This comprehensive, turnkey solution showcases I.C.T's unmatched capability in providing end-to-end LED production solutions. Click to discover how we can help you transform your manufacturing capabilities and lead your market with our innovative technology and expertise. More details, pls visit: https://www.smtfactory.com/one-stop-smart-factory-solution-for-led-lighting-manufacturing-in-tajikistan.html
Technical Library | 2007-06-21 17:03:16.0
The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture (...) While there have been several studies comparing these two attachment methods, this study highlights the effect of rework technique on the electrical characteristics and reliability of reworked BGAs.
Technical Library | 2015-08-27 15:32:16.0
Ever since there has been a widespread usage of surface mount parts, the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework of same. Todays' pitches are commonly 0.5 to 0.4mm with packages of tiny outline sizes, 5 -10mm square, making the rework of such devices a challenge. In addition to the handling and inspection challenges comes the board density. Spacing to neighboring components continues to be compressed so the rework techniques should not damage neighboring components.
Technical Library | 2019-07-27 07:13:16.0
Carrier Tape refers to a strip product used in the field of electronic packaging, which has a specific thickness, and equidistantly distributes holes (also called pockets) for holding electronic components in the longitudinal direction thereof. Positioning hole for index positioning.
Technical Library | 2021-07-10 05:42:16.0
An effective solution to reduce labor costs and improve production efficiency
Technical Library | 2024-12-03 16:50:16.0
A brief description of six different types of manufacturing methods you can use to have stainless steel cut.
Technical Library | 1999-05-09 13:07:16.0
This paper will give the reader a general understanding of EOS and ESD phenomena. It specifically addresses hand soldering's role in EOS and ESD and how to protect against and test for potential problems. It discusses how Metcal Systems address EOS and ESD concerns and how they differ from conventional soldering systems.
Technical Library | 2012-02-16 16:53:16.0
Channel simulations are only as accurate as the models used to develop them. While we have seen much effort placed on printed circuit board (PCB) materials (copper finish, dielectric moisture absorption), other elements within the channel have been largel
