Technical Library | 2012-09-20 21:45:38.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturin
Technical Library | 2017-09-13 00:20:21.0
The objective of the study is to examine the relationship between energy-resource depletion, climate change, health resources and the Environmental Kuznets Curve(EKC) under the financial constraint environment in the panel of selected developed countries, over the period of 2000–2013.
Technical Library | 2022-06-20 21:01:37.0
We've been doing a lot of print testing in our lab. In our first set of published results, "The Impact of Reduced Solder Alloy Powder Size on Solder Paste Print Performance1" from IPC/APEX 2016, we revealed a hierarchy of input variables to maximize solder paste transfer efficiency and minimize variation. In that study, we used a fully-optioned stencil as part of the equipment set. In order to tease out the data we were looking for, we could not lose critical information to the noise of stencil-induced variations.
Technical Library | 2018-11-20 21:33:57.0
There are several industry-accepted methods for determining the reliability of flux residues after assembly. The recommended methods of test sample preparation do not always closely mimic the thermal cycle experienced by an assembly. Therefore, extraction from actual assemblies has become a popular method of process control to assess consistency of post-reflow cleanliness. Every method of post-reflow flux residue characterization will depend on the reflow process followed to prepare the coupon.This investigation will focus on the effect of thermal conditions on the remainder of active ingredients in flux residues after assembly with no-clean solder pastes.
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