Technical Library: 2010 2010 (Page 1 of 7)

SMT Stencil Design And Consideration Base on IPC

Technical Library | 2010-03-23 11:50:22.0

This document discuss how to design SMT stencil base on IPC-7525. Introduction: PCBA (Printed Circuit Board Assembly) is a segment of printed circuit board technology. This segment of printed circuit board industry is concentrated in assemble all the pieces of electronic industry to one piece before output them to market. This segment covers: interconnection technology, package design technology, system integration technology, board and system test technology

Association Connecting Electronics Industries (IPC)

Reworking QFN's Newly Developed Cost Effective Approach

Technical Library | 2010-02-18 17:48:49.0

This paper describes a new rework process for leadless devices where the devices can be manually placed without relying on capital equipment.

BEST Inc.

A New Stenciling Method for Reworking SMT Components

Technical Library | 2010-07-15 19:19:56.0

When reworking more complex SMT components such as finer pitch SMT components, SMTconnectors and even area array devices, the most common method of printing on the printing selectively on the PCB has some serious shortcomings. The most significant problem

BEST Inc.

Component Shortages Causing Electronics Manufacturers to "Use All Means Necessary" to Ship Products

Technical Library | 2010-11-24 20:47:38.0

As the electronics manufacturing and assembly industry in the US recovers to some degree from the economic crisis which began in 2008, the challenge of component shortages has risen to the top as one of the stumbling blocks for contract assemblers and cap

BEST Inc.

Micro-Sectioning of PCBs for Failure Analysis

Technical Library | 2010-01-13 12:34:10.0

Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.

BEST Inc.

New Methods of Testing PCB Traces Capacity and Fusing

Technical Library | 2011-11-25 16:07:47.0

The article presents virtual and real investigations related to current capacity and fusing of PCB traces in high power applications and is based on a scientific paper delivered by authors at SIITME 2010 in Romania. The reason of performing the research a

UPB-CETTI University of Bucharest, Center for Technological Electronics and Interconnection Techniques

Criminal Prosecution - Who can be held liable for the sale of counterfeit parts?

Technical Library | 2011-09-26 13:53:30.0

On September 14, 2010, the late Shannon Wren, owner of VisionTech Components ("VisionTech"), and Stephanie McCloskey, VisionTech's Administrative Manager, were arrested during the execution of search and seizure warrants issued against the pair by the United States government after evidence connected them to the sale of counterfeit parts to the U.S. Navy, defense contractors and others. A ten-count indictment charged McCloskey with conspiracy, aiding and abetting in violation of Title 18 United States Code, Sections 371 and 2; trafficking in counterfeit goods, in violation of Title 18 United States Code, Section 2320; and mail fraud, in violation of Title 18 United States Code, Section 1341. McCloskey pled guilty to conspiracy and aiding and abetting for her role in the scheme.

ERAI Inc.

The Reliability Challenges of QFN Packaging

Technical Library | 2010-05-27 22:12:10.0

The quad flat pack no lead or quad flat non-leaded (QFN) is one of the fastest growing package types in the electronics industry today. While the advantages of QFNs are well documented, concerns arise with its reliability and manufacturability. Acceptance of this package, especially in long-life, severe-environment, high-reliability applications, is currently limited. One of the most common drivers for reliability failures is inappropriate adoption of new technologies, such as the case with QFN. In this presentation, we will review and discuss QFN related reliability concerns and challenges, and propose Physics-of-Failure (PoF) based approaches to allow the confident introduction of QFN components into electronics products.

DfR Solutions

The Universal PCB Design Grid System

Technical Library | 2010-01-27 19:22:04.0

This paper reviews one of the single most important, but sometimes overlooked or taken for granted, aspects of the electronics industry – The PCB Design Grid System

Valor Computerised Systems Ltd

Shedding Light on Machine Vision

Technical Library | 2010-04-07 18:54:31.0

For effective machine vision, the first step in devising a vision system should be the lighting. This paper reviews important criteria for setting up an effective lighting system.

Microscan

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