Technical Library: 2011 10inch conveyor (Page 1 of 1)

Evaluating The Accuracy Of a Nondestructive Thermocouple Attach Method For Area-Array Package Profiling

Technical Library | 2011-01-06 18:03:18.0

The oven recipe, which consists of the reflow oven zone temperature settings and the speed of the conveyor, will determine a specific time‐temperature profile for a given PCB assembly. In order to achieve a good quality PCB assembly, the time‐temperature

KIC Thermal

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