Technical Library | 2012-04-26 18:52:37.0
First presented at IPC Apex Expo 2012. The reliability, as tested by thermal cycling, of printed wire boards (PWB) are established by three variables; copper quality, material robustness and design. The copper quality was most influential and could be eva
Technical Library | 2012-05-31 18:01:31.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Considering technological advances in multi-depth cavities in the PCB manufacturing industry, various subtopics have materialized regarding the processing and application of such
Technical Library | 2012-10-11 19:50:09.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. This paper shows the benefits by using a pure palladium Layer in the ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold) and ENEP (Electroless Nickel, Electroless P
Technical Library | 2012-06-15 00:43:47.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. The world of spring-loaded test probes and special probes for in-circuit and functional tests have grown tremendously over the past few years. Ever increasing demands for electro
Technical Library | 2012-08-16 22:38:05.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniqu
Technical Library | 2013-05-02 12:45:25.0
Summary of some new and existing technologies for printed electronics outside of traditional membrane switch manufacturing. Discussion of requirements for understanding the technology of these applications in order to capitalize on them... First published in the 2012 IPC APEX EXPO technical conference proceedings.
Technical Library | 2012-01-05 18:40:07.0
Conformal coating is applied to circuit cards to provide a dielectric layer on an electronic board. This layer functions as a membrane between the board and the environment. With this coating in place, the circuit card can withstand more moisture by incre
Technical Library | 2012-05-31 23:35:31.0
Industrial network security solutions essential to today's PLC - SCADA security. Lack of security on an industrial network could cause a serious threat to the system, to the personnel involved in it, in fact, production machines networks without proper se
Technical Library | 2012-08-02 21:05:14.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Pure tin is a common finish for copper hook up wire, coaxial cable, ground braid and harness assemblies used on electronic assemblies. Historically there have been fewer reports o
Technical Library | 2012-08-23 21:06:35.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Tetrabromobisphenol-A (TBBPA) is the predominant flame retardant used in rigid FR-4 printed wiring boards (PWB). In this application, the TBBPA is fully reacted into the epoxy res
