Technical Library: 2012 and in and metric (Page 1 of 1)

SMT Manufacturability and Reliability in PCB Cavities

Technical Library | 2012-05-31 18:01:31.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Considering technological advances in multi-depth cavities in the PCB manufacturing industry, various subtopics have materialized regarding the processing and application of such

AT&S

Existing and Emerging Opportunities in Printed Electronics For Printers

Technical Library | 2013-05-02 12:45:25.0

Summary of some new and existing technologies for printed electronics outside of traditional membrane switch manufacturing. Discussion of requirements for understanding the technology of these applications in order to capitalize on them... First published in the 2012 IPC APEX EXPO technical conference proceedings.

Conductive Compounds, Inc.

Advances in Conductive Inks across Multiple Applications and Deposition Platforms

Technical Library | 2012-12-27 14:35:29.0

Printed Electronics is generally defined as the patterning of electronic materials, in solution form, onto flexible substrates, omitting any use of the photolithography, etching, and plating steps commonly found within the Printed Circuit Board (PCB) industry. The origins of printed electronics go back to the 1960s, and close variants of several original applications and market segments remain active today. Through the 1980s and 1990s Printed Electronic applications based on Membrane Touch Switch and Electroluminescent lighting technologies became common, and the screen printed electronic materials used then have formed the building blocks for many of the current and emerging technologies and applications... First published in the 2012 IPC APEX EXPO technical conference proceedings.

DuPont

Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment

Technical Library | 2012-09-20 21:45:38.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturin

Agilent Technologies, Inc.

Overcoming Logistic, Economic and Technical Challenges to Implementing Functional Test in High Mix / High Volume Production Environments

Technical Library | 2012-11-29 14:23:58.0

1000 units per day) production environment presents challenging technical, logistic and cost obstacles that are usually more complex than those encountered at the inspection (automated optical inspection) and the manufacturing process test step (in-circuit test).

SiFO Technologies

Quality Improvement and Enhanced Flexibility in Electronic Manufacturing through the Deployment of a modern Selective Soldering Process Technology

Technical Library | 2012-03-15 17:50:28.0

The competition in the EMS sector has considerably intensified over the last few years,. The enormous pressure to reduce production costs, which every service provider today has to face, frequently forces the organization to have a critical look at their

ASYS Group

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2012 and in and metric searches for Companies, Equipment, Machines, Suppliers & Information

ISVI High Resolution Fast Speed Industrial Cameras

High Throughput Reflow Oven
Fluid Dispensing, Staking, TIM, Solder Paste

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Selective soldering solutions with Jade soldering machine

High Resolution Fast Speed Industrial Cameras.