Technical Library | 2015-08-27 15:32:16.0
Ever since there has been a widespread usage of surface mount parts, the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework of same. Todays' pitches are commonly 0.5 to 0.4mm with packages of tiny outline sizes, 5 -10mm square, making the rework of such devices a challenge. In addition to the handling and inspection challenges comes the board density. Spacing to neighboring components continues to be compressed so the rework techniques should not damage neighboring components.
Technical Library | 2015-12-01 20:36:48.0
On January 1, 2015, nine months from APEX 2014, the production and use restrictions on HCFC-225 will be in effect throughout the United States. This phase out is encompassing in scope. This phase out will have significant technical, performance, and economic implications for the electronics industry. The regulatory situation remains fluid. A number of alternative solvents have been or are in the process of being developed. We discuss the options for assemblers and component manufacturers.
Technical Library | 2015-07-09 17:44:11.0
50,000) number of short duration (
Technical Library | 2015-05-27 11:47:47.0
It goes without saying that manufacturing companies want the highest possible quality at the lowest possible cost. These days, everyone is trying to do more with less in order to stay relevant in a competitive environment.
Technical Library | 2015-08-17 09:07:11.0
Since a high percentage of product failures can be traced to poor electrical connections, crimp quality is of paramount importance. There are many factors that come into play that affect crimp quality and knowing the relevant factors, and to what extent each factor affects the end result, will help to guide the process engineer towards achieving the best possible results.
Technical Library | 2015-09-03 18:06:11.0
While the density of chip-to-chip and chip-to-package component interconnections increases and their size decreases the ease of manufacture and the interconnection reliability are being reduced. This paper will introduce the use of embedded fibers in the interconnections as a means of addressing these issues.
Technical Library | 2015-10-22 17:37:28.0
The objective of this study is to evaluate conformal coatings for mitigation of tin whisker growth. The conformal coatings chosen for the experiment are acrylic, polyurethane and parylene. Also included in this paper are tin whisker inspection results of tin-plated braiding and wire that was exposed to an environment of 50°C with 50% relative humidity for over five years.
Technical Library | 2015-01-12 09:27:49.0
V2V is a collision avoidance technology that transmits data between vehicles to help warn drivers of potential crashes. This technology would improve safety by allowing vehicles to communicate with each other and exchange basic safety data, such as position and speed and warn the driver of potentially dangerous situations.
Technical Library | 2015-02-05 23:23:40.0
Ball grid arrays are the boon and bane of engineers and printed circuit board designers the world over. Their unparalleled pin density and low lead inductance are essential in today's high pin count, high frequency integrated circuits. However, that same pin density and unique interface create a challenge unique unto themselves. These challenges need to be faced head on since the ball grid array (BGA) is prevalent in modern PCBs. While there are entire textbooks that cover the topic of BGAs, their use and fanout techniques, the quick overview provided here offers an engineer a good starting point for improving BGA designs.
