Technical Library: 2020 driver au6550n2021e863 (Page 1 of 1)

Realization of a New Concept for Power Chip Embedding

Technical Library | 2020-10-18 19:31:27.0

Embedded components technology has launched its implementation in volume products demanding high levels of miniaturization. Small modules with embedded dies and passive components on the top side are mounted in hand held devices. Smartphones have been the enablers for this new technology using the capabilities of embedded components. With this technological background another business field became interesting for embedded components – the embedded power electronics. The roadmap of the automotive industry shows a clear demand for miniaturized power electronic applications. Drivers are the regulations for the international fleet emissions which are focusing on three major trends.

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Using Metal Core Printed Circuit Board (MCPCB) as a Solution for Thermal Management

Technical Library | 2020-06-19 19:08:14.0

The designs of electronic devices and systems are being continuously improved by becoming smaller in size and faster in communication speed. The potential risk associated with these specific design improvements will be an increase in power density and, consequently, a greater risk of thermal problems and failures. At the same time, the prevailing use of circuit boards integrated with power devices such as motor controllers and drivers, light-emitting diode (LED) lighting modules, power supplies, and amplifiers, and regulators for TV, etc., drive to the use of a proper thermal management system while designing these kinds of printed circuit board (PCB).

Hong Kong Polytechnic University [The]

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