Technical Library: 20mm 2014 2014 (Page 1 of 7)

Reliability of Reworked QFNs

Technical Library | 2014-09-11 11:43:48.0

In this DOD study the reliability of reworked QFNs is studied with the outcome being that a stay in place stencil does not impact the reliability of a QFN reworked using this technique

BEST Inc.

Plastic vs Metal Stencils for Prototype Printing

Technical Library | 2014-09-11 11:47:39.0

This article goes through the pluses and minuses of using plastic stencils for DIY prototypes. The release efficiency is measured and "rules of thumb" for using one type vs another is explained.

BEST Inc.

Reballing a QFN Simplifies QFN Rework

Technical Library | 2014-09-11 11:36:46.0

There are a variety of methods one can use to rework QFNs. This paper explains one of the ways to get very little center ground voiding while making it easy to place a tiny component with almost no keep out areas.

BEST Inc.

Expectations for Companies' Conflict Minerals Reporting

Technical Library | 2014-04-24 16:37:42.0

By May 31, 2014, it is expected that companies, officially known as issuers, will be required to take the unprecedented step of submitting their first conflict minerals disclosures to the Securities and Exchange Commission, or SEC. This paper is intended to describe the content that certain sustainable and responsible investors, or SRIs, and nongovernmental organizations, or NGOs, expect to see in an issuer's Specialized Disclosure, or Form SD, and Conflict Minerals Report, or CMR, if a CMR is deemed necessary.

Responsible Sourcing Network

HCFC-225 Phaseout - What Now?

Technical Library | 2015-12-01 20:36:48.0

On January 1, 2015, nine months from APEX 2014, the production and use restrictions on HCFC-225 will be in effect throughout the United States. This phase out is encompassing in scope. This phase out will have significant technical, performance, and economic implications for the electronics industry. The regulatory situation remains fluid. A number of alternative solvents have been or are in the process of being developed. We discuss the options for assemblers and component manufacturers.

BFK Solutions LLC

Environmentally sound: Aqueous cleaning with minimum water consumption

Technical Library | 2017-01-23 21:12:01.0

"Water is not a problem of the future, but a key issue of our time for businesses: In the future, urgent water risks will increase in many areas of the world. A growing population, a changing consumer behavior and climate change will have an immediate impact on the availability and quality of water and thus build further pressure on governments, businesses and societies." (Quote from the summary of the 2014 WWF study "The imported risk. Germany's water risk in the age of globalization.")

Kolb Cleaning Technology USA LLC

Performance of Light Emitting Diode on Surface Machined Heat Sink

Technical Library | 2014-05-15 14:26:27.0

350mA). Slotted surface showed good performance on both thermal and optical properties of the given 3W green LED.

Universiti Sains Malaysia

Understanding SIR

Technical Library | 2014-02-06 17:49:48.0

Many electronics manufacturers perform SIR testing to evaluate solder materials and sometimes the results they obtain differ significantly from those stated by the solder material provider. The difference in the results is typically the result of SIR coupon preparation. This paper will discuss the issue of SIR coupon preparation, board cleaning techniques, and how board cleanliness directly affects SIR results.

Indium Corporation

Data Bus Components - The Communication System that Helps in Transferring Data

Technical Library | 2014-03-27 07:57:13.0

Data bus in computer terminology is a communication system that helps in transferring data between components within a computer, or between separate computers. Know more about data bus components and advancements in data bus technology by reading this article.

Just Connectors

Thermal Shock and Drop Test Performance of Lead-free Assemblies with No-Underfill and Corner-Underfill

Technical Library | 2014-01-02 15:56:55.0

With ROHS compliance the transition to lead-free is inevitable. Several lead-free alloys are available in the market and its reliability has been the main concern. The results from this experimental research aims at making a comparison of different lead-free alloy combinations. Thermal shock and drop tests are a part of this experimental study.

Jet Propulsion Laboratory

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