Technical Library | 2014-09-11 11:36:46.0
There are a variety of methods one can use to rework QFNs. This paper explains one of the ways to get very little center ground voiding while making it easy to place a tiny component with almost no keep out areas.
Technical Library | 2014-04-24 16:37:42.0
By May 31, 2014, it is expected that companies, officially known as issuers, will be required to take the unprecedented step of submitting their first conflict minerals disclosures to the Securities and Exchange Commission, or SEC. This paper is intended to describe the content that certain sustainable and responsible investors, or SRIs, and nongovernmental organizations, or NGOs, expect to see in an issuer's Specialized Disclosure, or Form SD, and Conflict Minerals Report, or CMR, if a CMR is deemed necessary.
Technical Library | 2015-12-01 20:36:48.0
On January 1, 2015, nine months from APEX 2014, the production and use restrictions on HCFC-225 will be in effect throughout the United States. This phase out is encompassing in scope. This phase out will have significant technical, performance, and economic implications for the electronics industry. The regulatory situation remains fluid. A number of alternative solvents have been or are in the process of being developed. We discuss the options for assemblers and component manufacturers.
Technical Library | 2017-01-23 21:12:01.0
"Water is not a problem of the future, but a key issue of our time for businesses: In the future, urgent water risks will increase in many areas of the world. A growing population, a changing consumer behavior and climate change will have an immediate impact on the availability and quality of water and thus build further pressure on governments, businesses and societies." (Quote from the summary of the 2014 WWF study "The imported risk. Germany's water risk in the age of globalization.")
Technical Library | 2014-05-15 14:26:27.0
350mA). Slotted surface showed good performance on both thermal and optical properties of the given 3W green LED.
Technical Library | 2014-02-06 17:49:48.0
Many electronics manufacturers perform SIR testing to evaluate solder materials and sometimes the results they obtain differ significantly from those stated by the solder material provider. The difference in the results is typically the result of SIR coupon preparation. This paper will discuss the issue of SIR coupon preparation, board cleaning techniques, and how board cleanliness directly affects SIR results.
Technical Library | 2014-03-27 07:57:13.0
Data bus in computer terminology is a communication system that helps in transferring data between components within a computer, or between separate computers. Know more about data bus components and advancements in data bus technology by reading this article.
Technical Library | 2014-01-02 15:56:55.0
With ROHS compliance the transition to lead-free is inevitable. Several lead-free alloys are available in the market and its reliability has been the main concern. The results from this experimental research aims at making a comparison of different lead-free alloy combinations. Thermal shock and drop tests are a part of this experimental study.
Technical Library | 2014-02-13 16:46:23.0
The high speed transmission applications in the electronic product become inevitable developing trend. The signal integrity becomes the most important issue in the electronics industry. The material suppliers, PCB manufacturers, OEM designers commonly face the serious issue "how to keep signal integrity operated in the high speed transmission" for the modern electronic application nowadays
Technical Library | 2014-02-20 15:59:17.0
In this chapter, we discuss the type of parts used to create counterfeits and the defects/degradations inherent in these parts due to the nature of the sources they come from, proposed inspection standards, and limitations of these standards. The processes used to modify the packaging of these parts to create counterfeits are then discussed along with the traces left behind from each of the processes. We then present a systematic methodology for detecting signs of possible part modifications to determine the risk of a part or part lot being counterfeit.
