Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2023-03-13 19:35:47.0
Translational Research in Additive Manufacturing at GTMI * Additive manufacturing/3D printing process and equipment development (e.g., metal, polymer and composites part manufacturing) * Computational modeling and simulation of additive manufacturing/printed electronics processes * Advanced materials development for additive manufacturing/printed electronics * Application development and demonstration of additive manufacturing/printed electronics
Technical Library | 1999-05-07 10:16:31.0
This paper will describe practical aspects of a redundancy implementation on a high-volume cache memory product. Topics covered include various aspects of redundancy from a design and product engineering perspective; and present test development methods for future product implementations.
Technical Library | 2024-06-19 14:23:36.0
These guidelines on long-term storage are intended to help develop a supply strategy for components which need to be warehoused, processed and used beyond ...
Technical Library | 2020-03-12 13:10:35.0
The electronics industry is further progressing in terms of smaller, faster, smarter and more efficient electronic devices. This continuous evolving environment caused the development on various electrolytic copper processes for different applications over the past several decades. (...) This paper describes the reasons for development and a roadmap of dimensions for copper filled through holes, microvias and other copper plated structures on PCBs.
Technical Library | 1999-05-06 14:48:20.0
This paper describes manufacturing operations design and analysis at Intel. The complexities and forces of both the market and the manufacturing process combine to make the development of improved semiconductor fabrication manufacturing strategies (like lot dispatching, micro and macro scheduling policies, labor utilization, layout, etc.) particularly important...
Technical Library | 2018-11-14 21:43:14.0
Status of flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill will be reviewed in this study. Emphasis is placed on the latest developments of these areas in the past few years. Their future trends will also be recommended. Finally, the competition on flip chip technology will be briefly mentioned.
Technical Library | 1999-05-07 10:13:38.0
This paper will review the device physics governing the operation of the industry standard ETOX™ flash memory cell and show how it is ideally suited for multiple bit per cell storage, through its storage of electrons on an electrically isolated floating gate and through its direct access to the memory cell.
Technical Library | 2021-07-27 14:49:16.0
Conductive anodic filament (CAF) formation, a failure mode in printed wiring boards (PWBs) that are exposed to high humidity and voltage gradients, has caused catastrophic field failures. CAF is an electrochemical migration failure mechanism in PWBs. In this article, we discuss CAF, the factors that enhance it, and the necessary conditions for its occurrence. Published studies are discussed, and the results of historical mean time to failure models are summarized. Potential reasons for CAF enhancement solutions are discussed, and possible directions in which to develop anti-CAF materials are proposed.
Technical Library | 2020-06-10 01:42:55.0
Recent advancement of flexible wearable electronics allows significant enhancement of portable, continuous health monitoring and persistent human-machine interfaces. Enabled by flexible electronic systems, smart and connected bioelectronics are accelerating the integration of innovative information science and engineering strategies, ultimately driving the rapid transformation of healthcare and medicine. Recent progress in the development and engineering of soft materials has provided various opportunities to design different types of mechanically deformable systems towards smart and connected bioelectronics.
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