Technical Library: 3 main parts (Page 1 of 4)

KE-2050/KE-2060 Causes and Countermeasures of Patch Failure

Technical Library | 2023-07-22 02:26:05.0

Patch offset; Uneven patches throughout the substrate (each substrate is offset in a different way); Only part of the substrate is offset; Only certain components are offset; The patch Angle is offset; Component absorption error; Laser identification (component identification) error; Nozzle loading and unloading error; Mark (BOC mark, IC mark) identification error; Image recognition error (KE-2060 only); Analysis of the main reasons for throwing material. More information about KINGSUN please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Revolutionize PCB Manufacturing with SMT Dispensing Machines

Technical Library | 2023-12-18 11:33:57.0

Elevate your electronic manufacturing game with the I.C.T-D600 SMT Dispensing Machine! Precision, safety, and efficiency in one powerful solution. ​In the dynamic realm of electronic manufacturing, precision and efficiency are not just preferences but essential requirements. Introducing the I.C.T-D600, an automatic glue dispenser machine engineered to enhance production processes across various applications. From chip encapsulation to PCB assembly, SMT red-glue dispensing, LED lens production, and medical device creation, SMT dispensing machine is a versatile solution tailored to meet the demands of the industry. Essential Attributes Of The I.C.T-D600 Automatic Glue Dispenser Machine 1. Compliance with European Safety Standards: The I.C.T-D600 SMT dispensing machine prioritizes not only efficiency but also safety, boasting compliance with European safety standards and holding a CE certificate. This ensures a secure and reliable manufacturing environment, aligning with global quality benchmarks. 2. International Component Quality: Internationally renowned components form the core of the D600 SMT dispensing machine. From Panasonic servomotors to MINTRON CCD, each element is carefully selected, guaranteeing high performance and durability. This commitment to quality components results in a machine that operates seamlessly, reducing downtime and maintenance costs. 3. Impressive Performance Metrics: The SMT dispensing machinedoesn't just meet expectations; it surpasses them with exceptional performance metrics: Maximum Guide Rail Speed: 400mm/s Fastest Injection Valve Speed: 20 spots/sec Dispensing Accuracy: ±0.02mm Repeated Accuracy: ±0.01mm Machine Characteristics: Core Part – Jet Valve The non-contact jet dispensing method ensures high-speed operation (max jet speed: 20 spots/second), high accuracy with a minimum dispensing volume of 5nl, and flexibility with extremely small dispensing volumes. The thermostatic system for the flow channel and sprayer ensures uniform glue temperature, resulting in low maintenance costs and an extended service life. Enhanced Capacity: Non-contact jet dispensing eliminates the need for Z-axis motion. Integrated temperature control technology reduces manual intervention. Automatic glue compensation minimizes artificial regulation time. Dual-track design reduces waiting time. Automatic visual location identification and compensation. Non-contact height detection with laser reduces height detection time. Flexibility: Capable of handling substrates or backings of various sizes. Optional heating module. Independent control of dual tracks with user-friendly software. Fast switching between different product lines. Universal platform suitable for various processes with different glues

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

UV Laser PCB Depaneling Machine Improve Cutting Effect

Technical Library | 2021-09-02 08:17:07.0

We are a professional manufacturer of PCB depaneling machines, which is workable for all boards, including flex and regid boards, v-scored boards and routed boards. Laser pcb depaneling is non-contact way without mechanical stress,this solution is good for modern precision PCB depaneling. It has below advantages: 1. No dust The production environment of the circuit board industry is carried out in the dust-free workshop. The traditional pcb depaneling equipment, such as blade moving type machine, will inevitably produce residues and micro powder, which will pollute the 10000 and 1000 class dust-free workshops and affect the conductivity of products. The UV laser PCB cutting machine is a vaporization processing process, which will not produce dust and is conducive to the conductivity of the product. 2. High cutting precision The processing gap of high-precision traditional processing equipment can not reach the gap width of less than 100 microns, which will cause certain damage to the lines on the edge or PCBA circuit board containing components. The focus spot of the laser cutting machine is small, and the ultraviolet cold processing mode has little thermal impact on the edge of the circuit board. The cutting position accuracy is less than 50 microns, and the cutting size accuracy is less than 30 microns, which will not affect the edge of the circuit board, and the precision is high. 3. No stress Traditional processing methods generally have V-grooves, which will cause certain damage to the board in the manufacturing process. The UV laser PCB cutting machine can directly cut the bare board without making V-grooves. In addition, the traditional processing methods directly use tools to act on the circuit board, especially the stamping method has a great impact on the circuit board, which is easy to cause board deformation. The laser cutting machine is a non-contact processing mode, which acts on the surface of the material through the high-energy beam, which will not cause the influence of stress and the deformation and damage of the circuit board. 4. For special-shaped cutting, it is easy to automate The UV laser PCB cutting machine can cut for any shape without replacing any props and fixtures, and without steel mesh. The same equipment can meet special-shaped and straight-line cutting, which is easy to realize assembly line automatic production and high flexibility. It is easy to improve production efficiency and save production process and production cycle. In particular, it can quickly and efficiently meet the needs of rapid proofing, directly import the drawing, and then locate the cutting. 5. High compatibility The UV laser PCB cutting machine can process the materials around the circuit board, such as PCB, FPC, covering film, pet, reinforcing board, IC, ultra-thin metal cutting, etc. it has strong practicability, is compatible with the processing of a variety of materials, is easy to operate, can be imported into the drawing, does not need to adjust any mechanical parts, and is easy to operate and maintain. 6. Good cutting edge effect The cutting edge is smooth and neat without burr. It can be processed and formed directly according to the size of the drawing, which is conducive to improving the yield of the product. It can be directly installed into the subsequent process without further processing. For more details about UV laser depaneling, please feel free to contact us. www.pcbdepanelingrouter.com

Winsmart Electronic Co.,Ltd

00345186 27856240 0020 5283 pick and place parts L&A Ea Mch Fuehrungswagen Kwve

Technical Library | 2022-10-31 09:05:54.0

Warranty: 3 Months Precision: High Precision Certification: CE,ROHS Wight: 1kg Automatic Grade: Automatic Trademark: Ultra High-speed Chip Mounter High Light: 00345186, 00345186 smt pick and place parts, 00345186 SMT Spare Parts

Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

The climatic test chamber after-sale service

Technical Library | 2019-06-18 03:23:42.0

After-sale service Climatest Symor® strictly controls every production procedure,our main after-sale service procedure is as follow: 1) Email Climatest Symor® about the fault description(Pictures or video is preferred) 2) Within 1 working days, Climatest Symor® gives feedback or solution (If Climatest Symor® needs customer to take pictures about some parts of the machine, customer should cooperate accordingly to settle issues. 3) If checked that some parts(except glass nozzle) is possible broken by non-artificial reason, If necessary, customer deliver the broken part to Climatest Symor®, later Climatest Symor® send the repaired part or new part to customer. If unnecessary, Climatest Symor® will make delivery for the new part to customer directly. Remark:During warranty, Climatest Symor® is responsible for delivery fees both ways and parts fees.After warranty, Customer is responsible for the delivery fees both ways,Climatest Symor® will provide the parts to customer by cost price.

Symor Instrument Equipment Co.,Ltd

What are the packaging forms of electronic components

Technical Library | 2021-12-31 06:09:47.0

The packaging method of surface mount components has become an important part of the SMT system. It directly affects the efficiency of assembly production and must be optimized in combination with the type and number of feeders of the SMT machine. There are four main types of packaging for surface mount components, Tape, tube, tray and bulk.

Shenzhen Sewate Technology Co.,Ltd

Thermal Shock and Drop Test Performance of Lead-free Assemblies with No-Underfill and Corner-Underfill

Technical Library | 2014-01-02 15:56:55.0

With ROHS compliance the transition to lead-free is inevitable. Several lead-free alloys are available in the market and its reliability has been the main concern. The results from this experimental research aims at making a comparison of different lead-free alloy combinations. Thermal shock and drop tests are a part of this experimental study.

Jet Propulsion Laboratory

Why salt spray chamber fail to spray salt mist?

Technical Library | 2019-11-20 22:44:25.0

Salt spray test chamber is used to test teh salt corrosion resistance ability of hardware, metal and other auto parts,the chamber can quickly detect the corrosion resistance degree of products in the temperature, humidity and salt spraying environment, which can effectively improve production efficiency. So what is the reason why such a salt spray test chamber does not spray? As per our past maintenance experience,there are below reasons,customers can have a look,hope it is helpful: 1, the spray tower is blocked; 2, water pipes clogged, water flow can not go in; 3, the air compressor stops running,pls open the air compressor button; 4, main switch of the air compressor outlet is not turned on,pls turn on. 5, the solenoid valve fails, the pressure meter is broken or the pressure is too low, pls check with Climatest and repair it. 6, when the nozzle is clogged, the nozzle should be carefully removed and cleaned,because it is fragile. 7, if the spray pressure is normal, the position of the nozzle glass is also correct, but what is the reason for not spraying? In this case, it is necessary to carefully observe whether there is dirt at the contact surface of the nozzle. If so, clean up the dirt and the spray can be carried out normally. That‘s all we‘re going to talk about today. If you have any questions, follow us on facebook, Please feel free to ask us questions.

Symor Instrument Equipment Co.,Ltd

Characterization of Solder Defects on Package on Packages with AXI Systems for Inspection Quality Improvement

Technical Library | 2016-05-30 22:24:00.0

As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls, we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-CT imaging. The new results are compared with the results of earlier AXI measurements. It is found that 3D measurements offer better defect inspection quality, lower false call and escapes.

Flex (Flextronics International)

Approaches for additive manufacturing of 3D electronic applications

Technical Library | 2020-09-16 21:24:56.0

Additive manufacturing processes typically used for mechanical parts can be combined with enhanced technologies for electronics production to enable a highly flexible manufacturing of personalized 3D electronic devices. To illustrate different approaches for implementing electrical and electronic functionality, conductive paths and electronic components were embedded in a powder bed printed substrate using an enhanced 3D printer. In addition, a modified Aerosol Jet printing process and assembly technologies adapted from the technology of Molded Interconnect Devices were applied to print circuit patterns and to electrically interconnect components on the surface of the 3D substrates.

Institute for Factory Automation and Production Systems (FAPS)

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