Technical Library | 2023-09-15 10:06:49.0
Enhance your electronics manufacturing with our SMT On-line 3D Solder Paste Inspection Machine. Achieve unmatched precision and accuracy in solder paste inspection for optimal PCB assembly. Streamline your production process and minimize defects with cutting-edge 3D technology. Explore how this machine can revolutionize your soldering process and ensure top-quality electronics.
Technical Library | 2015-04-29 03:48:39.0
SPI equipment is routinely used in Printed Circuit Board (PCB) manufacturing to monitor and control one of the most crucial steps affecting the finished quality of circuit board. Solder paste deposition is the key process in board assembly operations using SMT techniques. Our LSM™ system was the industry's first popular method of manually inspecting solder paste; our SE systems revolutionized SMT production by offering an automated method for performing in-process 3D inspection on the assembly line. SPI systems measure the height and volume of the solder pads before the components are applied and the solder melted, and when used properly, can reduce the incidence of solder-related defects to statistically insignificant amounts. Critical to the SPI measurement is the accuracy of the height measurement because that has a direct correlation with solder volume and defects.
Technical Library | 2008-05-28 18:41:53.0
This paper describes correlation between a true 2D area measurement (e.g. printer) and a height map generated area from a SPI system. In addition, this paper will explore the correlation between area/volume measurements and bridge detection between 2D/3D techniques. The ultimate goal is to arm the process engineers with information that can be used to make decision that will impact defects, cost, throughput and Return On Investment.
Technical Library | 2016-05-30 22:24:00.0
As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls, we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-CT imaging. The new results are compared with the results of earlier AXI measurements. It is found that 3D measurements offer better defect inspection quality, lower false call and escapes.
Technical Library | 2017-08-28 17:14:41.0
PCB suppliers in the automotive space are vastly accelerating their time to market by using automated optical inspection (AOI) systems during PCB assembly. However, this next-generation technique is not limited in scope to the automotive industry – it has powerful implications for the entire PCB industry.
Technical Library | 2018-03-07 22:41:05.0
This study investigates the scooping effect during solder paste printing as a function of aperture width, aperture length and squeegee pressure. The percent of the theoretical volume deposited depends on the PWB topography. A typical bimodal percent volume distribution is attributed to poor release apertures and large apertures, where scooping takes place, yielding percent volumes 100%. This printing experiment is done with a concomitant validation of the printing process using standard 3D Solder Paste Inspection (SPI) equipment.
Technical Library | 2021-08-04 18:46:25.0
The process of printed circuit board assembly (PCBA) involves several machines, such as a stencil printer, placement machine and reflow oven, to solder and assemble electronic components onto printed circuit boards (PCBs). In the production flow, some failure prevention mechanisms are deployed to ensure the designated quality of PCBA, including solder paste inspection (SPI), automated optical inspection (AOI) and in-circuit testing (ICT). However, such methods to locate the failures are reactive in nature, which may create waste and require additional effort to be spent re-manufacturing and inspecting the PCBs. Worse still, the process performance of the assembly process cannot be guaranteed at a high level. Therefore, there is a need to improve the performance of the PCBA process. To address the aforementioned challenges in the PCBA process, an intelligent assembly process improvement system (IAPIS) is proposed, which integrates the k-means clustering method and multi-response Taguchi method to formulate a pro-active approach to investigate and manage the process performance.
Technical Library | 2021-09-29 13:35:21.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.
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