Technical Library | 2016-08-25 17:05:48.0
Sustainable product design and the task of bringing new, earth friendly products to market is a top priority for corporate leaders in the manufacturing industry. By not reaching their compliance and sustainability goals, manufacturers risk loss of market share, fines for non-compliance against regulatory directives and possible damage to their brand. Managing material disclosure information from the supply chain is one of their biggest challenges.
Technical Library | 2021-07-27 14:49:16.0
Conductive anodic filament (CAF) formation, a failure mode in printed wiring boards (PWBs) that are exposed to high humidity and voltage gradients, has caused catastrophic field failures. CAF is an electrochemical migration failure mechanism in PWBs. In this article, we discuss CAF, the factors that enhance it, and the necessary conditions for its occurrence. Published studies are discussed, and the results of historical mean time to failure models are summarized. Potential reasons for CAF enhancement solutions are discussed, and possible directions in which to develop anti-CAF materials are proposed.
Technical Library | 2023-10-09 16:10:02.0
This document provides high-level PCB design, sensor mounting, and handling guidelines for TDK IMU devices, which incorporate a combination of gyroscopes and accelerometers. Each sensor has specific requirements to ensure the highest performance in a finished product. For a layout assessment of your design, including placement and estimated temperature disturbances, please contact TDK. The TDK IMU devices discussed in this document (ICM-40607x, ICM-40608, ICM-42xxx, ICM-43xxx, and ICM-45xxx products) consist of 3-axis MEMS gyroscopes and 3-axis MEMS accelerometers.
Technical Library | 2014-05-29 13:48:14.0
Electronics packaging based on stress-engineered spring interconnects has the potential to enable integrated IC testing, fine pitch, and compliance not readily available with other technologies. We describe new spring contacts which simultaneously achieve low resistance ( 30 μm) in dense 2-D arrays (180 ~ 180-µm pitch). Mechanical characterization shows that individual springs operate at approximately 150-µN force. Electrical measurements and simulations imply that the interface contact resistance contribution to a single contact resistance is This paper suggests that integrated testing and packaging can be performed with the springs, enabling new capabilities for markets such as multichip modules.
Technical Library | 2009-03-27 22:22:40.0
The Sn-Ag-Cu (SAC) alloys have been considered promising replacements for the lead-containing solders for the microelectronics applications. However, due to the rigidity of the SAC alloys, compared with the Pb-containing alloys, more failures have been found in the drop and high impact applications for the portable electronic devices, such as the personal data assistant (PDA), cellular phone, notebook computer..etc
Technical Library | 2021-08-11 01:00:37.0
Conformal coatings and potting materials continue to create issues for the electronics industry. This webinar will dig deeper into the failure modes of these materials, specifically issues with Coefficient of Thermal Expansion (CTE), delamination, cracking, de-wetting, pinholes/bubbles and orange peel issues with conformal coatings and what mitigation techniques are available. Similarly, this webinar will look at the failure modes of potting materials, (e.g Glass Transition Temperature (Tg), PCB warpage, the effects of improper curing and potential methods for correcting these situations.
Technical Library | 1999-05-07 08:04:23.0
Stereolithography is a handy tool not only for speeding a design to market but also in giving customers an early edge. By allowing a form-and-fit sample to be quickly made from a computer model, stereolithography coupled with simultaneous engineering allows customers to see product models early in the design cycle. And if a picture is worth a thousand words, what's a tangible sample worth?
Technical Library | 2011-03-30 21:14:33.0
The expression "multifunctional PCB", as a synonym for a PCB which is applicable with a variety of assembly techniques, is already established on the market. That means the PCB can be used for multiple reflow soldering and multiple assembly techniques lik
Technical Library | 2021-12-16 01:48:41.0
Package-on-Package (PoP) technology is widely used in mobile devices due to its simple design, lower cost and faster time to market. Warpage characteristic and requirement of PoP package becomes critical to ensure both the top and bottom package can be mounted with minimal yield lost. With this challenge in placed, iNEMI has been working relentlessly to fingerprint the current PoP package technology warpage characteristic and to establish some key learning for packaging technologies. The work also extended to understand the basic requirement needed for successful PoP stacking by analyzing the warpage data obtained and formulate a simple analytical equation to explain the true warpage requirement for PoP packaging.
Technical Library | 2016-06-23 13:24:56.0
Proper assembly of components is critical in the manufacturing industry as it affects functionality and reliability. In a heat sink assembly, a detailed manual process is often utilized. However, an automated fixture is used whenever applicable.This paper will illustrate the use of strain gauge testing and Finite Element Analysis (FEA) as a simulation tool to evaluate and optimize the heat sink assembly process by manual and automated methods. Several PCBAs in the production line were subjected to the manual and automated assembly process. Strain gauge testing was performed and FEA models were built and run. Results were compared with the goal of improving the FEA model. The updated FEA model will be used in simulating different conditions in assembly. Proposed improvement solutions to some issues can also be verified through FEA.
