Technical Library: a-d (Page 1 of 1)

Samsung Pneumatic SMT Spare Parts SM24mm Cylinder J67011042A

Technical Library | 2022-10-31 08:39:26.0

Minimum Order Quantity: 1/pcs Price: Negotiable,EXW Price Packaging Details: High quality carton packaging Delivery Time: 1-2 work days Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram Supply Ability: 1000pcs monthly, delivery time 1-2 days

Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

MMMA3ACN2A SMT Spare Parts AC Servo Motor SM411Z-Axis Motor Brand New

Technical Library | 2022-10-31 08:40:27.0

Minimum Order Quantity: 1/pcs Price: Negotiable,EXW Price Packaging Details: High quality carton packaging Delivery Time: 1-2 work days Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram Supply Ability: 1000pcs monthly, delivery time 1-2 days

Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

0032254403 A700 Vacuum Nozzle Type 418 SIEMENS AG Pip 418 Komplett Vectra

Technical Library | 2022-10-31 09:21:53.0

Minimum Order Quantity: 1/pcs Price: Negotiable,EXW Price Packaging Details: High quality carton packaging Delivery Time: 1-2 work days Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram Supply Ability: 1000pcs monthly, delivery time 1-2 days

Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

Reliability Challenges in Fabrication of Flexible Hybrid Electronics for Human Performance Monitors: A System Level Study

Technical Library | 2020-11-10 15:43:25.0

Flexible hybrid electronics (FHE) interface rigid electronic components with flexible sensors, circuits, and substrates. This paper reports the reliability improvement of a FHE Human Performance Monitor (HPM), designed to monitor electrocardiography (ECG) signals.

Stanford University

Flexible Hybrid Electronics: Direct Interfacing of Soft and Hard Electronics for Wearable Health Monitoring

Technical Library | 2021-08-18 01:30:18.0

The interfacing of soft and hard electronics is a key challenge for flexible hybrid electronics. Currently, a multisubstrate approach is employed, where soft and hard devices are fabricated or assembled on separate substrates, and bonded or interfaced using connectors; this hinders the flexibility of the device and is prone to interconnect issues. Here, a single substrate interfacing approach is reported, where soft devices, i.e., sensors, are directly printed on Kapton polyimide substrates that are widely used for fabricating flexible printed circuit boards (FPCBs).

University of California Berkeley

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