Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2022-06-27 17:04:51.0
In today's Electronics Manufacturing Industry, standards for defect and quality control are stricter than ever due to advancements of electronic products and increasing safety and environmental regulations. Electronics Manufacturers are forced to maximize their production efficiency by implementing lean manufacturing initiatives and optimizing production processes. With this in mind, manufacturers are relying upon Automated Optical Inspection (AOI) equipment to streamline the manufacturing process and provide real time root cause analysis of manufacturing defects. The objective is to increase profitability by improving production yields and reducing costly rework.
Technical Library | 2023-09-15 11:16:39.0
Elevate your electronics manufacturing with the SMT Offline X-Ray Machine. Achieve comprehensive component inspection and reliability assurance through advanced X-ray technology.
Technical Library | 2023-09-15 11:40:46.0
Improve your PCB assembly process with our advanced offline PCBA router machine. Achieve precision and speed in PCB separation for top-quality results
Technical Library | 2023-09-15 11:54:37.0
Elevate your PCB assembly process with our advanced online PCBA laser cutting machine. Achieve unmatched precision and efficiency for top-quality results.
Technical Library | 2023-09-16 06:02:10.0
Discover our cutting-edge online radial insertion machine for precise and efficient PCB assembly. Elevate production speed and accuracy with advanced technology.
Technical Library | 2023-09-15 11:15:49.0
Experience unmatched component inspection precision with our SMT Offline X-Ray solution. Detect defects, ensure quality, and boost production efficiency with advanced X-ray technology.
Technical Library | 2023-09-15 09:48:55.0
Discover the ultimate defense for your electronics with the PCBA Conformal Coating Machine. Achieve precise and reliable conformal coatings to safeguard PCBAs against environmental stressors. Elevate your electronic manufacturing process with this advanced coating solution.
Technical Library | 2023-09-16 03:50:08.0
Learn everything you need to know about DIP assembly lines, from the basics to advanced topics. This guide covers the components of a DIP assembly line, the process of DIP assembly, and the benefits of using DIP assembly lines.
Technical Library | 2023-09-18 03:35:54.0
Experience seamless LED assembly with our state-of-the-art fully automatic SMT printer. Boost efficiency and precision in LED production. Discover our advanced SMT solutions today!
