Technical Library | 2011-11-10 18:06:17.0
With the advent of larger packages and higher densities/pitch the Industry has been concerned with the coplanarity of both the substrate package and the PCB motherboard. The iNEMI PCB Coplanarity WG generated a snapshot in time of the dynamic coplanarity
Technical Library | 2011-12-01 16:57:22.0
Are electronics any “greener” than before RoHS? It is a fair question to ask. With the advent of RoHS on July 1, 2006, and more recently REACH, one might be inclined to answer that it is greener than it was. We will take a look at this question in several
Technical Library | 1999-08-09 11:36:27.0
Shrinking process technologies and increasing design sizes continually challenge design methodologies and EDA tools to develop at an ever-increasing rate. Before the complexities of deep submicron (DSM), gate and transistor delays dominated interconnect delays, and enabled simplified design methodologies that could focus on device analysis. The advent of DSM processes is changing all of this, invalidating assumptions and approximations that existing design methodologies are based upon, and forcing design teams to re-tool. High-capacity parasitic extraction tools are now critical for successful design tape-outs.
Technical Library | 2014-05-08 16:34:16.0
Bare die mounting on multi-device substrates has been in use in the microelectronics industry since the 1960s. The aerospace industry’s hybrid modules and IBM’s Solid Logic Technology were early implementations that were developed in the 1960’s. The technologies progressed on a steady level until the mid 1990’s when, with the advent of BGA packaging and chip scale packages, the microelectronics industry started a wholesale move to area array packaging. This paper outlines the challenges for both traditional wire-bond die attached to a printed wiring board (pwb), to the more recent applications of bumped die attached to a high performance substrate.
Technical Library | 2017-06-13 13:28:22.0
The advent of miniaturized electronics for mobile phones and other portable devices has required the assembly of smaller and smaller components. Currently 01005 passives and 0.3 mm CSPs are some of the components that must be assembled to enable these portable electronic devices. It is widely accepted that about 65% of all end of the line defects occur in the stencil printing process. Given all of the above, it is critical that a precision stencil printing process be developed to support miniaturized electronic assembly.This paper is a summary of a significant amount of experimental data and process optimization techniques that were employed to establish a precision SMT printing process.
Technical Library | 2021-12-02 01:44:00.0
With the advent of Industry 4.0, production processes have been endowed with intelligent cyber-physical systems generating massive amounts of streaming sensor data. Internet of Things technologies have enabled capturing, managing, and processing production data at a large scale in order to utilize this data as an asset for the optimization of production processes. In this work, we focus on the automatic detection of physical defects in the production of surfacemount devices. We show how to build a classification model based on random forests that efficiently detects defect products with a high degree of precision. In fact, the results of our preliminary experimental analysis indicate that our approach is able to correctly determine defects in a simulated production environment of surface-mount devices with a MCC score of 0.96. We investigate the feasibility of utilizing this approach in realistic settings. We believe that our approach will help to advance the production of surface-mount devices.
Technical Library | 2019-03-15 16:26:50.0
While there have been quite dramatic and evident improvements in almost every facet of manufacturing over the last several decades owing to the advent and mass adoption of computer automation and networking, there is one aspect of production that remains stubbornly unaffected. Massive databases track everything from orders, to inventory, to personnel. CAD systems allow for interactive and dynamic 3D rendering and testing, digital troubleshooting, and simulation and analysis prior to mass production. Yet, with all of this computational power and all of this networking capability, one element of production has remained thoroughly and firmly planted in the past. Nearly all manufacturing or assembly procedures are created, deployed, and stored using methodologies derived from a set of assumptions that ceased to be relevant fifty years ago. This set of assumptions, referred to below as the “Paper Paradigm” has been, and continues as the dominant paradigm for manufacturing procedures to this day. It is time for a new paradigm, one that accounts for the vastly different technological landscape of this era, one that provides a simple, efficient interface, deep traceability, and dynamic response to rapidly changing economic forces.This paper seeks to present an alternative. Instead of enhancing and improving on systems that became irrelevant with the invention of a database, instead of propping up an outdated, outmoded and inefficient system with incremental improvements; rewrite the paradigm. Change the underlying assertions to more accurately reflect our current technological capability. Instead of relying on evolutionary improvements, it is time for a revolution in manufacturing instructions.
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