Technical Library: allowing (Page 2 of 9)

BGA Rework. A Comparative Study of Selective Solder Paste Deposition For Area Array Packages

Technical Library | 2007-02-01 09:57:15.0

The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture.

BEST Inc.

Selective Solder Paste Deposition Reliability Test Results.

Technical Library | 2007-06-21 17:03:16.0

The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture (...) While there have been several studies comparing these two attachment methods, this study highlights the effect of rework technique on the electrical characteristics and reliability of reworked BGAs.

BEST Inc.

What Makes Flex Circuit Assembly Different?

Technical Library | 2018-02-18 19:28:55.0

Flex circuits allow manufacturers to be more creative than ever.

Power Design Services

Stereolithography and Simultaneous Engineering Speed Products to Market

Technical Library | 1999-05-07 08:04:23.0

Stereolithography is a handy tool not only for speeding a design to market but also in giving customers an early edge. By allowing a form-and-fit sample to be quickly made from a computer model, stereolithography coupled with simultaneous engineering allows customers to see product models early in the design cycle. And if a picture is worth a thousand words, what's a tangible sample worth?

TE Connectivity

The Effect Of Metallic Impurities On The Wetting Properties Of Solder

Technical Library | 1999-05-07 10:38:11.0

This paper is a report of a study made to determine the maximum allowable impurities in solder used for wave soldering applications. This report concludes with a list of impurities compiled from actual analyses of solder which caused production problems. A list of recommended maximum allowable impurities will assist in establishing reliable quality controls on the purity level of the solder in a wave soldering machine.

Kester

High Precision Laser Cutting

Technical Library | 2024-06-14 21:38:09.0

This type of laser cutting is the most successful and effective practice to achieve quality clean edges and superior products. As opposed to more traditional methods (water jets, punches), laser cutting allows the material to be processed once with extraordinary accuracy and without any other interventions to get a finished piece. It also allows for less waste and is less time consuming, resulting in cleaner production and the ability to manufacture in greater quantities. No matter how complex or straightforward, we achieve the precise, fine cut, details your company needs.

A-Laser, Inc.

Manufacturing Considerations When Implementing Voc-Free Flux Technology

Technical Library | 1999-05-07 11:44:26.0

In 1990 the United States Environmental Protection Agency Issued the Clean Air Act. The Clean Air Act and subsequent amendments are designed to limit the use of chemicals that contain volatile organic compounds (VOCs). The document goes into great detail setting limits for allowable VOC emissions for different industries.

Kester

Net Ties and How to Use Them

Technical Library | 2010-11-16 12:06:38.0

The Net Tie is a component type which allows for shorting together various nets in a design. The graphic for the symbol can be as simple as two component pins representing a virtual component between nets or as complex as mutipul pins (as many as desired)

Altium

Matrix maintenance in PXI with BIRST

Technical Library | 2011-04-21 18:55:48.0

Switching systems, and in particular matrices are a key part of many tests systems, they allow a single core set of test equipment to be connected to the UUT, saving the cost of duplicating test equipment. That places the switching matrix in a very vulner

Pickering Interfaces Ltd.

Accurately Capturing System-Level Failure of Solder Joints

Technical Library | 2020-02-05 18:20:06.0

Consortium Projects - Thermal Cycling Reliability Consortium projects allow for joint research to investigate the reliability of multiple solder alloys under a variety of environmental stress conditions. Project jointly sponsored by iNEMI and HDP User Group and including CALCE and Universal consortium currently assessing 15 third-generation solder alloys..

DfR Solutions (acquired by ANSYS Inc)


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