Technical Library: allowing (Page 4 of 10)

Implementation of a High-Quality Dolby* Digital Decoder Using MMX™ Technology

Technical Library | 1999-05-07 10:23:43.0

Software decoding of Dolby Digital allows it to become a baseline capability on the PC, with greater flexibility than a hardware approach. Intel's MMX™ technology provides instructions that can significantly speed up the execution of the Dolby Digital decoder, freeing up the processor to perform other tasks such as video decoding and/or audio enhancement. Intel has worked closely with Dolby Laboratories to define an implementation of Dolby Digital based on MMX technology that has achieved Dolby's certification of quality.

Intel Corporation

Large Thin Organic PTFE Substrates for Multichip Applications

Technical Library | 2007-06-13 13:44:10.0

Very high performance computer applications have created a demand for large organic substrates capable of interconnecting one or a few ASIC semiconductor devices with packaged memory devices. The electrical advantages offered by the use of a thin PTFE composite substrate were coupled with intrinsic mechanical advantages to create very high performance applications. The application development required interactions of design, fabrication, and new manufacturing technology to obtain rapid prototype production and allow a successful ensuing manufacturing ramp.

i3 Electronics

Optimizing Thermal and Mechanical Performance in PCBs

Technical Library | 2008-02-04 12:13:38.0

Engineers are always striving to make a lighter, faster and stronger PCB. In order to achieve their designs, engineers must turn to alternative materials to enhance their designs. There are many materials that allow for thermal, coefficient of thermal expansion (CTE) and rigidity. Many times if a material enables an engineer to have CTE they will have to sacrifice thermal. Currently carbon composite laminates are being used in order to achieve an ideal PCB with thermal, CTE and rigidity with almost no weight premiums.

Stablcor

5 Axis Fluid Dispensing

Technical Library | 2015-07-31 16:28:16.0

Technology is in constant change and circuit assembly is no different. It is becoming more and more advanced as needs change and demands for more capabilities increase. In order to meet these demands, equipment manufacturers are integrating the latest innovations and tools to serve the industry. The need to better protect printed circuit assemblies from harsh environments using automated selective conformal coating is becoming a must. 5 axis fluid dispensing allows conformal coating to be applied to printed circuit assemblies like never before.

ETS - Energy Technology Systems, Inc.

What Is Turnkey Electronic Manufacturing?

Technical Library | 2017-06-23 12:42:59.0

End-to-end PCB assembly by world-class companies like Power Design Services allows you to focus on your core competencies with the added benefits of reduced cost and time to market. From material procurement to circuit board design and manufacturing, and supply chain management, we serve your needs helping you reach customers faster. Here is an overview of what our turnkey electronic manufacturing services consist of, and how you can use them to reduce your build time and cost.

Power Design Services

Smart and Connected Bioelectronics for Seamless Health Monitoring and Persistent Human-Machine Interfaces

Technical Library | 2020-06-10 01:42:55.0

Recent advancement of flexible wearable electronics allows significant enhancement of portable, continuous health monitoring and persistent human-machine interfaces. Enabled by flexible electronic systems, smart and connected bioelectronics are accelerating the integration of innovative information science and engineering strategies, ultimately driving the rapid transformation of healthcare and medicine. Recent progress in the development and engineering of soft materials has provided various opportunities to design different types of mechanically deformable systems towards smart and connected bioelectronics.

Georgia Institute of Technology

Troubleshooting the STM32F429 board and restoring its operation

Technical Library | 2020-11-19 10:15:54.0

How to repair boards if they have been produced for a long time, and the documentation is lost? In this case, intelligent recognition systems can help, which will allow you to identify component pins without documentation for the board. In this article, we will find the STM32F429 board malfunctions without any documentation and in the least amount of time.

Engineering Physics Center of MSU

Considerations for Minimizing Radiation Doses to Components during X-ray Inspection

Technical Library | 2022-02-21 19:49:16.0

The ability to undertake non-destructive testing on semiconductor devices, during both their manufacture and their subsequent use in printed circuit boards (PCBs), has become ever more important for checking product quality without compromising productivity. The use of x-ray inspection not only provides a potentially non-destructive test but also allows investigation within optically hidden areas, such as the wire bonding within packages and the quality of post solder reflow of area array devices (e.g. BGAs, CSPs and flip chips).

Nordson DAGE

Stencil Design For Mixed Technology Through-Hole / Smt Placement And Reflow

Technical Library | 2023-06-12 18:52:18.0

This paper will review stencil design requirements for printing solder paste around and in through-hole pads / openings. There is much interest in this procedure since full implementation allows the placement of both through-hole components as well as SMD's and the subsequent reflow of both simultaneously. This in turn eliminates the need to wave solder or hand solder through-hole components.

Photo Stencil LLC

The Pin-in-Paste (or AART) Process for Odd Form and Through Hole Printed Circuit Boards

Technical Library | 2007-09-27 16:18:15.0

Considerable interest exists in the process known as the pinin- paste, or the Alternative Assembly and Reflow Technology (AART) process. The AART process allows for the simultaneous reflow of both odd-form and through hole devices as well as surface mount components. This process has several advantages over the typical mixed technology process sequence that includes wave soldering and/or hand soldering, often in addition to reflow soldering.

Universal Instruments Corporation


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