Technical Library | 2023-09-07 14:54:10.0
A global manufacturer of a broad line of electronic interconnect solutions worked with us to dispense conductive adhesive EpoTek H20E-FC. EpoTek H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly. The primary goal was filling a rectangular cavity on a connector. The epoxy needed to fill the connector to the top of the walls in less than three seconds.
Technical Library | 2019-05-23 10:27:13.0
The technical tips have offered valuable details and techniques into various aspects of electronics manufacturing. This has been validated by the reader responses concurring with our assessments, offering additional insight, or in some rare cases, stating divergent points of view on any particular matter. In a bit of a strategic departure from the normal range of electronic manufacturing topics, ACI Technologies,Inc. would like our readers to consider the importance of being well prepared in the arena of designed experiments in order to properly qualify a manufacturing process. This particular topic has relevance because of the associated scope of work ACI Technologies encounters in numerous projects from material R&D to manufacturing process optimization, which require appropriate experimental designs to ascertain the significant data.
Technical Library | 2019-09-03 17:06:09.0
Both optical and scanning electron microscopy (SEM) are powerful tools for failure analysis in electronics and are used for low and high magnification examination. This article will provide detailed, step by step information for examining solder joints.
Technical Library | 2019-05-29 10:42:23.0
Battery selection should be considered early during the design phase of affordable electronic systems. The important choice of an appropriate battery can reduce system acquisition costs and keep logistics support costs down for the life of the system.
Technical Library | 2019-06-20 07:45:19.0
One of the two basic risks of employing the commercially accepted, Restriction of Hazardous Substances (RoHS) compliant, lead-free (Pb-free) electronics is the threat to the electronics reliability from the growth of tin whiskers. The other basic risk deals with Pb-free solder joint reliability.
Technical Library | 2019-05-29 10:40:59.0
Design for Test or Design for Testability (DFT) can best be described as the techniques utilized to add testability features to an electronic hardware product design. These added features make it easier to develop and apply manufacturing tests to assure that the product functions correctly.
Technical Library | 2020-08-05 17:13:12.0
A primary issue in electronics reliability for military applications is the ability to ensure long term operability in harsh, extreme environments. This requires more rigid standards, such as the MIL-STD-883 (Department of Defense Test Method Standard for Microcircuits), which commercial grade electronics typically do not satisfy. A solution commonly employed is to package the critical electronic components in hermetically sealed metal or ceramic enclosures which are costly and labor intensive. Not only are the components more expensive, but the assembly process is more difficult to automate, resulting in a substantial cost premium for military grade electronics.
Technical Library | 2019-05-31 14:21:59.0
Microelectronics is the manufacture of systems built from extremely small electronic components. In today’s electronic world, devices must be portable, equipped with wireless technology and are driven by size, weight, power, and cost (SWaP-C). These system level drivers are crucial to all current and future electronic applications from personal computers and cellular telephones to military-fielded hardware, biomedical instrumentation, and space-flight hardware.
Technical Library | 2019-06-05 11:11:06.0
As electronic products increase in functionality and complexity, there is an emphasis on affordability, miniaturization, and energy efficiency. The telecommunications, automotive, and commercial electronic markets are the leading drivers for these trends. These markets see high volume manufacturing with millions of units priced to the fraction of the cent. The choice of the packaging material for the electrical components for these markets can have a substantial effect on the cost of the final product. Therefore plastic encapsulated components are almost universally used in non-military applications over the conventional ceramic or metal electronic packages.
Technical Library | 2019-06-18 10:18:00.0
ACI Technologies is tasked with decapsulation of electronics components for testing and investigative purposes. In the normal method of decapsulation, an analyst will drill a small indentation, with a rotary tool, in the hermetic sealant material and then apply Nitric acid to eat through the polymeric encapsulant.
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
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