Technical Library: any (Page 3 of 10)

Connector Models - Are They Any Good?

Technical Library | 2012-02-16 16:53:16.0

Channel simulations are only as accurate as the models used to develop them. While we have seen much effort placed on printed circuit board (PCB) materials (copper finish, dielectric moisture absorption), other elements within the channel have been largel

Samtec, Inc.

PCB Molding An Upward Curve Of Innovation In Building Protection Systems

Technical Library | 2016-08-11 01:21:34.0

Be it a residential building, hospital, shopping mall, hotel, school, educational institution or any kind of a building, the security of the building is a prime facet to get a complete building solution. This also includes protecting the building, its assent and the human life from the airborne toxic industrial chemical, radiological and biological attacks or any accidental release apart from fire, water, earthquake and other security concerns. For these high value security solutions, the upgraded technology for the building safety system is now a top priority, especially in the commercial building sector and residential constructions. To introduce a completely new concept and a unique solution, it is necessary to focus on the dynamic electronic design and manufacturing solution in consultation with the custom PCB experts.

Technotronix

Just‐In‐Time Material Management for the PCB Industry

Technical Library | 2017-11-03 13:34:15.0

As with any production industry, businesses in the PCB industry need to maintain a healthy balance between the components they keep in stock and those they use for meet client orders. Ordering too many components comes with serious disadvantages, as does not ordering enough, and PCB manufacturers need to stay as close as possible to a happy medium between the two.

Power Design Services

Soldering to Gold Over Nickel Surfaces

Technical Library | 1999-05-07 11:28:39.0

There are many things that can go wrong when soldering to gold plate over nickel surfaces. First of all, we know that gold and solder are not good friends, as any time solder comes into contact with gold, something seems to go wrong. Either the solder bonds to the gold and eventually pulls off as the tin and gold cross-migrate, leaving voids; or the solder completely removes the gold and is expected to bond to the metal which was under the gold.

Kester

Pre-Compliance Testing the Conducted Line Emissions of DC Supplied Circuits

Technical Library | 1999-07-20 11:00:12.0

It's quite common for a power supply (PSU) designer to work with a circuit designer to realize a system design compliant with international EMC regulations. PSU designers will be well aware of the requirement of the power supply to provide clean DC voltage and not disturb the AC mains voltage. However, they may not have any idea of the noise that can potentially be introduced to the mains through the PSU by the target circuit. Likewise, the circuit designers (digital or analogue) may not know what attenuation the PSU will provide.

Murata Manufacturing Co., Ltd.

Real-Time Yield Monitoring Through ERP Systems

Technical Library | 2007-04-25 21:54:26.0

Globalization and increased competition requires an enterprise to focus on cost reduction, improved manufacturing processes and higher standards of quality. Effective yield management using Enterprise Resource Planning (ERP) systems is crucial for the success of any manufacturing organization. An ERP system provides the infrastructure for consolidating all business operations by integrating the information flow across functions, including production planning and control.

i3 Electronics

Lean, Mean Dual-Lane Machines

Technical Library | 2007-12-27 11:41:37.0

The latest screen printing platforms unlock more of the potential from dual-lane processing. Simultaneous demands to enhance flexibility while increasing utilisation and overall throughput apply to manufacturers operating at virtually any point in the mix-volume continuum: capacity must work hard to deliver the required return. As these lean manufacturing principles hold sway from the US and Europe to the Far East, no modern assembler has a second to spare.

ASM Assembly Systems (DEK)

Controlling Copper Build Up in Automatic Soldering Equipment Using Lead-Free Solder

Technical Library | 2008-11-20 00:46:10.0

The Sn/Ag/Cu family of alloys is the leading candidate for a lead-free alternative. The first part of this study was to determine if there is any significant difference between Sn/Ag/Cu alloys when used in automatic soldering equipment in terms of copper build-up in the system. The study compared two Sn/Ag/Cu alloys to determine if at processing temperatures one alloy would absorb less copper than the other alloy.

AIM Solder

How to Profile a PCB

Technical Library | 2009-04-22 21:13:19.0

An optimal reflow profile is one of the most critical factors in achieving quality solder joints on a printed circuit board (PCB) assembly with surface mount components. A profile is a function of temperatures applied to the assembly over time. When graphed on a Cartesian plane, a curve is formed that represents the temperature at a specific point on the PCB, at any given time, throughout the reflow process.

DDM Novastar Inc

How to Profile a PCB.

Technical Library | 2010-09-10 09:47:06.0

An optimal reflow profile is one of the most critical factors in achieving quality solder joints on a printed circuit board (PCB) assembly with surface mount components. A profile is a function of temperatures applied to the assembly over time. When graphed on a Cartesian plane, a curve is formed that represents the temperature at a specific point on the PCB, at any given time, throughout the reflow process.

Robert Bosch LLC Automotive Electronics Division


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