Technical Library: application (Page 11 of 34)

Achieving Large Scale Parallelism Through Operating System Resource Management on the Intel TFLOPS Supercomputer

Technical Library | 1999-05-07 09:58:23.0

From the point of view of an operating system, a computer is managed and optimized in terms of the application programming model and the management of system resources. For the TFLOPS system, the problem is to manage and optimize large scale parallelism. This paper looks at the management in terms of three key topics: memory management, communication, and input/output.

Intel Corporation

MMX™ Microarchitecture of Pentium® Processors With MMX Technology and Pentium® II Microprocessors

Technical Library | 1999-05-07 10:22:03.0

The MMX™ technology is an extension to the Intel Architecture (IA) aimed at boosting the performance of multimedia applications. This technology is the most significant IA extension since the introduction of the Intel386™ microprocessor. The challenge in implementing this technology came from retrofitting the new functionality into existing Pentium® and Pentium® Pro processor designs.

Intel Corporation

A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing

Technical Library | 2007-12-13 17:03:02.0

Printer-hosted processes for solder ball placement are now widely used for package technologies ranging from BGAs using ball diameters above 750μm to the latest WL-CSPs demanding 250μm diameter. This broadening spectrum of applications brings more choices in terms of stencil design rules and production methodologies.

ASM Assembly Systems (DEK)

Wafer-Level Packaged MEMS Switch With TSV

Technical Library | 2012-02-02 19:09:53.0

A miniaturized wafer-level packaged MEMS acceleration switch with through silicon vias (TSVs) was fabricated, based on technologies suitable for harsh environment applications. The high aspect ratio TSVs were fabricated through the silicon-on-insulator (S

The Foundation for Scientific and Industrial Research - SINTEF

1 Liter of Gap Filler in Only 13 Seconds - New Dispensing Solution for the Thermal Management for HV Batteries

Technical Library | 2018-06-18 13:43:56.0

Thermal influences can significantly compromise the service life, capacity and especially the operational safety of HV batteries. In order to prevent damage due to excessive temperatures, large quantities of heat-conducting potting media are used here. Scheugenpflug has developed a new system solution for fast and reliable application of these materials.

Scheugenpflug Inc.

Closed‑Loop Recycling of Copper from Waste Printed Circuit Boards Using Bioleaching and Electrowinning Processes

Technical Library | 2021-02-04 01:56:56.0

In the present study, a model of closed-loop recycling of copper from PCBs is demonstrated, which involves the sequential application of bioleaching and electrowinning to selectively extract copper. This approach is proposed as part of the solution to resolve the challenging ... doi.org/10.1007/s12649-020-01128-9

Waste and Biomass Valorization

Microbial Nanocellulose Printed Circuit Boards for Medical Sensing

Technical Library | 2021-04-01 14:40:08.0

We demonstrate the viability of using ultra-thin sheets of microbially grown nanocellulose to build functional medical sensors. Microbially grown nanocellulose is an interesting alternative to plastics, as it is hydrophilic, biocompatible, porous, and hydrogen bonding, thereby allowing the potential development of new application routes. Exploiting

U.S. Naval Research Laboratory

The Effects of Long-Term Storage on Solderability of Semiconductor Components

Technical Library | 2022-03-02 21:52:34.0

In today's consumer-driven electronic marketplace many products have a limited useful life and component suppliers are moving to shorter product lifecycles. However, there are several industries that require semiconductor components to have a much longer lifecycle. In many cases application lifecycles within the Industrial, Automotive, Medical, Aerospace and Defense sectors may extend up to 30 years or more. As a result, an ongoing component supply becomes critical to sustaining these applications throughout their useful lifecycle. For this reason, it is often a requirement that semiconductor components be stored for extended periods of time after production ends.

Rochester Electronics LLC

Illinois-Intel Multithreading Library: Multithreading Support for Intel Architecture Based Multiprocessor Systems

Technical Library | 1999-05-07 10:04:13.0

Powerful desktop multiprocessor systems based on the Intel Architecture (iA) offer a formidable alternative to traditional scientific/engineering workstations for commercial application developers at an attractive costperformance ratio. However, the lack of adequate compiler and runtime library support for multithreading and parallel processing on Windows NT* makes it difficult or impossible to fully exploit the performance advantage of these multiprocessor systems. In this paper we describe the design, development, and initial performance results of the Illinois-Intel Multithreading Library (IML), which aims at providing an efficient and powerful (in terms of types of parallelism it supports) API for multithreaded application developers.

Intel Corporation

Inclusion Voiding in Gull Wing Solder Joints

Technical Library | 2012-08-30 21:24:29.0

This paper provides definitions of the different voiding types encountered in Gull Wing solder joint geometries. It further provides corresponding reliability data that support some level of inclusion voiding in these solder joints and identifies the final criteria being applied for certain IBM Server applications. Such acceptance criteria can be applied using various available x-ray inspection techniques on a production or sample basis. The bulk of supporting data to date has been gathered through RoHS server exempt SnPb eutectic soldering operations but it is expected to provide a reasonable baseline for pending Pb-free solder applications.

IBM Corporation


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