Technical Library: application (Page 15 of 33)

Reliability Considerations of Electrically Conductive Adhesives.

Technical Library | 1999-07-21 09:00:55.0

Isotropic conductive adhesives are typically silver filled epoxy resins. Electronics assemblers have evaluated these materials for a variety of unique interconnect applications. The goal is a conductive polymer that exhibits similar reliability and performance to traditional solder while offering the benefits of a polymer structure such as low temperature processing and good thermal stability as well as the ability to bond a variety of substrates.

Henkel Electronic Materials

Printable Nanocomposites for Electronic Packaging

Technical Library | 2008-06-25 16:11:51.0

Printing technologies provide a simple solution to build electronic circuits on o low cost flexible substrates. Nanocomposites will play important role for developing advanced printable technology. Advanced printing is relatively new technology and need more characterization and optimization for practical applications. In the present paper, we examine the use of nanocomposites or materials in the area of printing technology.

i3 Electronics

Screen and Stencil Printing Processes for Wafer Backside Coating

Technical Library | 2009-09-09 15:08:19.0

Stencil printing equipment has traditionally been used in the surface mount assembly industry for solder paste printing. In recent years the flexibility of the tool has been exploited for a wide range of materials and processes to aid semiconductor packaging and assembly. One such application has been the deposition of adhesive coatings onto the backside of silicon wafers.

ASM Assembly Systems (DEK)

The Importance of Viscosity in Conformal Coating Process Control

Technical Library | 2013-10-13 10:22:48.0

There are numerous factors which directly affect the conformal coating process to greater or lesser degrees. Those which have major impacts irrespective of the substrate / PCB and assemblies include choice of coating material and method of application. Whether conformal coating boards by dip, robot, batch spray or brush methods the viscosity of the coating is a critical factor in the overall process control.

SCH Technologies

Conformal Coating Thickness Measurement

Technical Library | 2013-10-13 10:54:13.0

The measurement of the conformal coating thickness on a printed circuit board (PCB) to ensure internal and international standards are met is now a critical factor in conformal coating process control. There are several methods for measurement of conformal coating thickness and they fall into two categories. These categories are wet film measurements applied during coating application and dry film measurements made after the coating is dried enough not to damage the coating.

SCH Technologies

SOMABLACK

Technical Library | 2024-06-28 21:22:38.0

SOMABLACK, produced by Somar Corporation, is rapidly becoming the top choice for many applications that require low to zero light reflectivity. It is a polyester-based material, mixed with black carbon to create something that both shades light and reduces reflection, while also having excellent dimensional stability. It is available in a range of options, with varying thicknesses, specular glossiness, optical density, and coatings.

A-Laser, Inc.

The Effect Of Metallic Impurities On The Wetting Properties Of Solder

Technical Library | 1999-05-07 10:38:11.0

This paper is a report of a study made to determine the maximum allowable impurities in solder used for wave soldering applications. This report concludes with a list of impurities compiled from actual analyses of solder which caused production problems. A list of recommended maximum allowable impurities will assist in establishing reliable quality controls on the purity level of the solder in a wave soldering machine.

Kester

Improvement of Organic Packaging Thermal Cycle Performance Measurement

Technical Library | 2006-11-01 22:37:23.0

Flip Chip Plastic Ball Grid Array (FCPBGA) modules, when subjected to extreme environmental stress testing, may often reveal mechanical and electrical failure mechanisms which may not project to the field application environment. One such test can be the Deep Thermal Cycle (DTC) environmental stress which cycles from -55°C to 125°C. This “hammer” test provides the customer with a level of security for robustness, but does not typically represent conditions which a module is likely to experience during normal handling and operation.

IBM Corporation

Manufacturers at the Crossroads: ERP or Best-of-Breed Software?

Technical Library | 2007-05-17 16:44:37.0

In the quest for quality, selecting the right Statistical Process Control (SPC) Software system doesn't boil down to a simple functional "fit-to-requirements" anymore. Once the expert domain of highly focused, independent software developers, the competitive landscape has changed dramatically with the influx of big-name ERP software providers who are aggressively promoting integrated quality modules within an all-encompassing business application framework.

Zontec, Inc.

Two-Photon Polymerization: A New Approach to Micromachining

Technical Library | 2007-07-24 11:47:54.0

The rapid technical development of ultrashort laser systems is creating exciting possibilities for very precise localization of laser energy in time and space. These achievements have triggered novel laser applications based on nonlinear interaction processes. A promising three-dimensional microfabrication method that has recently attracted considerable attention is based on two-photon polymerization with ultrashort laser pulses.

Aerotech, Inc.


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