Technical Library: application (Page 17 of 33)

Stencil Design Guidelines for Electronics Assembly Technologies.

Technical Library | 2014-03-13 15:25:01.0

A student competition paper at Budapest University of Technology And Economics, Department of Electronics Technology gives background, covers stencil design and discusses stencils intended for pin in paste application. The stencil applied for depositing the solder paste is a thin, 75–200 µm thick metal foil, on which apertures are formed according to the solder pads on the printed circuit board. Stencil printing provides a fast, mass solder paste deposition process; relatively expensive, appropriate and recommended for mass production.

Budapest University of Technology and Economics

Today's Vapor Phase Soldering An Optimized Reflow Technology for Lead Free Soldering

Technical Library | 2014-03-20 12:37:39.0

In the beginning of SMT, Vapor Phase Soldering was the preferred reflow soldering technology because of its excellent heat transfer capabilities. There were also some disadvantages like fast temperature rise, nearly no influence on the temperature profiles and high costs. So the use of Vapor Phase Soldering was reduced to special applications with high mass or complex boards in low numbers (e.g. for military or aerospace use).

IBL - Löttechnik GmbH

CONFORMAL COATING FOR WATER RESISTANT CIRCUIT ASSEMBLIES

Technical Library | 2015-08-18 17:48:53.0

Why Selectively Conformal Coat the Electronic Assembly? Printed circuit boards (PCBs) are employed in a variety of products and devices, and this means that it might be necessary for your PCBs to be moisture resistant. It is important to choose the right type of conformal coating so you need not worry about the durability of your product. Fortunately, there are several options available that can help, and you can even use selective conformal coating robots to provide proper application of the coating.

ETS - Energy Technology Systems, Inc.

Today's Smaller Cables Require Automated Processing

Technical Library | 2016-06-21 09:15:31.0

The trends in mobile electronics today are smaller, thinner and lighter. Yet, mobile devices are more powerful than ever. Applications, like wireless internet connections, RFID and Bluetooth, that have become essential in today’s devices, require more complex transmission mechanisms. As a result, manufacturers find themselves faced with the challenge of working with ultra-miniature RF cable assemblies.

Schleuniger, Inc.

PCB-Conformal-Coatings-Guide-I

Technical Library | 2016-09-06 04:54:27.0

Printed circuit boards are the base of electronic products in a variety of consumer and industrial applications. New PCBs always perform well. However, their performance will deteriorate with time due to exposure to different environmental conditions like condensation, moisture, contamination of the iconic material on the surface, dust and dirt, mildew, alpha particles, etc. To avoid these problems, PCBs are protected with conformal coatings. Let’s see how this is done, and how they protect PCB components.

Sierra Assembly Technology LLC

Privacy Threats through Ultrasonic Side Channels on Mobile Devices

Technical Library | 2017-05-11 18:03:24.0

Device tracking is a serious threat to the privacy of users, as it enables spying on their habits and activities. A recent practice embeds ultrasonic beacons in audio and tracks them using the microphone of mobile devices. In this paper, we explore the capabilities, the current prevalence and technical limitations of this new tracking technique based on three commercial tracking solutions. To this end, we develop detection approaches for ultrasonic beacons and Android applications capable of processing these.

Technical University Braunschweig

Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift

Technical Library | 2017-09-07 13:56:11.0

As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized.

Teledyne DALSA

When the Soldering Specialist Bans Soldering Fume

Technical Library | 2019-05-24 07:26:39.0

Soldering system vendor SEHO runs a Technology Center in its headquarters in Germany, in which all available machines are exhibited and demonstrated. Additionally, the SEHO Academy provides knowledge as a perfect balance of theory and practical application. In both facilities soldering fume occurs, which has damaging effects on human health, manufacturing equipment and products. That's why the company had installed several air cleaning solutions in terms of fume extraction technology. How and why they take care of clean air is the subject of this article.

ULT Canada Sales Incorporated

SMT Under Stencil Wiper Rolls

Technical Library | 2019-06-03 21:07:34.0

The objective of this White Paper is to provide users of the above products in the electronics industry a clear understanding of the different types of stencil cleaning paper/fabrics that are currently available. Fine pitch applications are more the norm now and so the performance of stencil cleaning rolls is more critical than ever before. This White Paper will give solder paste stencil printing engineers and purchasing professionals an insight into the main products on the market, thereby enabling them to make informed decisions.

Swiftmode Malaysia (Penang) Sdn Bhd

Key Technology Choices For Optimal Massive IoT Devices

Technical Library | 2019-11-26 15:57:27.0

The latest cellular communication technologies LTE-M and NB-IoT enable the introduction of a new generation of IoT devices that deliver on the promise of scalable, cost-effective massive IoT applications using LPWAN technology. However, a few key technology choices are necessary to create IoT devices that can support the multitude of existing and emerging massive IoT use cases..

Ericsson AB


application searches for Companies, Equipment, Machines, Suppliers & Information

Blackfox IPC Training & Certification

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
IPC Training & Certification - Blackfox

Component Placement 101 Training Course
2024 Eptac IPC Certification Training Schedule

High Throughput Reflow Oven


500+ original new CF081CR CN081CR FEEDER in stock