Technical Library | 2014-07-17 17:01:10.0
Embedded computing systems used in many military and avionics applications are trending toward higher heat fluxes, and as a result performance is being hindered by thermal limitations. This is intensified by the high ambient conditions experience by today’s modern warfighter. In many applications liquid cooling is replacing air flow through chassis for both thermal and environmental benefits(...) This paper outlines a series of passive thermal improvements which are easily integrated into legacy, or existing, systems and can provide a 3-4x increase in dissipated power.
Technical Library | 2009-12-09 19:28:28.0
A fundamental evaluation of a variety of approaches for designing a high-speed (10 Gb/s) serial differential electrical channel is examined. The application of the electrical interface has been simulated using HSpice software. It demonstrated how the signal quality could be affected by the use of microstrip versus stripline traces and their associated advantages and disadvantages is discussed. Example XFI channels were assembled from the simulation results to demonstrate viability of the application.
Technical Library | 1999-05-06 13:41:18.0
Invented in 1971, the microprocessor evolved from the inventions of the transistor (1947) and the integrated circuit (1958). Essentially a computer on a chip, it is the most advanced application of the transistor. The influence of the microprocessor today is well known, but in 1971 the effect the microprocessor would have on everyday life was a vision beyond even those who created it. This paper presents the history of the microprocessor in the context of the technology and applications that drove its continued advancements.
Technical Library | 2009-03-27 22:22:40.0
The Sn-Ag-Cu (SAC) alloys have been considered promising replacements for the lead-containing solders for the microelectronics applications. However, due to the rigidity of the SAC alloys, compared with the Pb-containing alloys, more failures have been found in the drop and high impact applications for the portable electronic devices, such as the personal data assistant (PDA), cellular phone, notebook computer..etc
Technical Library | 2009-06-11 18:28:24.0
XLamp LEDs lead the solid-state lighting industry in brightness while providing a reflow-solderable design that is optimized for ease of use and thermal management. Lighting applications featuring XLamp LEDs maximize light output and increase design flexibility, while minimizing environmental impact. This application note serves as a guide to understanding thermal management of XLamp LEDs and minimizing the effects of elevated junction temperatures.
Technical Library | 2014-12-04 18:27:40.0
A review on applications of metal-based inkjet inks for printed electronics with a particular focus on inks containing metal nanoparticles, complexes and metallo-organic compounds. The review describes the preparation of such inks and obtaining conductive patterns by using various sintering methods: thermal, photonic, microwave, plasma, electrical, and chemically triggered. Various applications of metal-based inkjet inks (metallization of solar cell, RFID antennas, OLEDs, thin film transistors, electroluminescence devices) are reviewed.
Technical Library | 2016-04-28 14:43:23.0
Underfilling is a long-standing process issued from the micro-electronics that can enhance the robustness and the reliability of first or second-level interconnects for a variety of electronic applications. Its usage is currently spreading across the industry fueled by the decreasing reliability margins induced by the miniaturization and interconnect pitch reduction. (...) This paper will address the control of surface mount under filled assemblies, focusing on applicable inspection techniques and possible options to overcome their limitations.
Technical Library | 2019-05-01 10:07:37.0
Adhesive bonding involves the use of adhesive to form a material bond between two or more assembly parts. In addition to regular adhesive bonding applications, hybrid processes, in which the adhesive bond includes another function such as sealing or heat dissipation, are gaining importance. Traditional joining methods such as welding or bolting are progressively being replaced in industrial applications by efficient adhesive bonding processes, since these processes provide a number of advantages such as part weight reduction or simplified parts handling.
Technical Library | 2021-04-01 14:36:51.0
This document provides information about the Surface Mount Technology (SMT) board assembly of Infineon Thin Small Non-leaded Packages (TSNP). The specific dimensions of the leadframe based inner setup depend on the size of the chip and the type of bonding. The field of application ranges from linear voltage regulators for weight-limited applications such as cellular phones and digital cameras to linear voltage regulators for the automotive sector.
Technical Library | 2022-01-19 17:25:29.0
Electrochemical sensors are a class of sensors in which the transducer component is the electrode. These methods are presently utilized in a wide assortment of business applications. These sensors are significant for some factors: the utilization of the electron for signal obtaining, which is known to be a perfect model for logical applications, without squander age; scaling down in versatile gadgets (test microvolume investigation); quick examination; and minimal effort of creation, permitting these techniques to be promoted (for example as business glucose sensors).
