Technical Library | 2019-07-17 17:56:34.0
The increased demand for electronic devices in recent years has led to an extensive research in the field to meet the requirements of the industry. Electrolytic copper has been an important technology in the fabrication of PCBs and semiconductors. Aqueous sulfuric acid baths are explored for filling or building up with copper structures like blind micro vias (BMV), trenches, through holes (TH), and pillar bumps. As circuit miniaturization continues, developing a process that simultaneously fills vias and plates TH with various sizes and aspect ratios, while minimizing the surface copper thickness is critical. Filling BMV and plating TH at the same time, presents great difficulties for the PCB manufactures. The conventional copper plating processes that provide good via fill and leveling of the deposit tend to worsen the throwing power (TP) of the electroplating bath. TP is defined as the ratio of the deposit copper thickness in the center of the through hole to its thickness at the surface. In this paper an optimization of recently developed innovative, one step acid copper plating technology for filling vias with a minimal surface thickness and plating through holes is presented.
Technical Library | 2016-10-24 15:14:23.0
Biosensors – a new Sensor Type from IST AG What are Biosensors? A biosensor is a device capable of detecting a certain substance or analyte with high specificity. Examples of such analytes are glucose, lactate, glutamine and glutamate. Most biosensors measure the concentration of an analyte in an aqueous solution, usually producing an electrical signal, which is proportional to the analyte’s concentration in its measuring range. An enzymatic biosensor comprises an enzyme, which recognizes and reacts with the target analyte generating a chemical signal, a transducer, which produces a physical signal out of that chemical one, and an electronic amplifier, which conditions and amplifies the signal. Biosensors allow the analysis in complex biological media. The detection of a large number of compounds is of great relevance not only for scientific research but also for process control in the chemical and food industry. It is also indispensable in the health care field for the diagnosis and treatment of diseases and monitoring of illnesses. The pharmaceutical and biotechnology industries greatly desire frequent to continuous analysis of biological media. Such analyses are conducted with the aid of analytical instruments like HPLC systems, which, although robust and reliable, are expensive and have a limited suitability for online operation. For this reason, the acquisition of Jobst Technologies GmbH positions IST AG as a key provider of high-performance and reliable online biosensors.
Technical Library | 2010-09-23 20:23:37.0
Methods of effective and ecological recycling of printed circuit boards (PCBs) are searched all over the world at this time. The material composition and temperature properties of PCB are necessary to be known for an optimal recycling technology. For thi
Technical Library | 2018-05-09 22:15:29.0
Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may electrically short circuit neighboring features on the PCB. The iNEMI technical subcommittee on creep corrosion has developed a flowers-of-sulfur (FOS) based test that is sufficiently well developed for consideration as an industry standard qualification test for creep corrosion. This paper will address the important question of how relative humidity affects creep corrosion. A creep corrosion tendency that is inversely proportional to relative humidity may allow data center administrators to eliminate creep corrosion simply by controlling the relative humidity in the data center,thus, avoiding the high cost of gas-phase filtration of gaseous contamination. The creep corrosion relative humidity dependence will be studied using a modified version of the iNEMI FOS test chamber. The design modification allows the achievement of relative humidity as low as 15% in the presence of the chlorine-releasing bleach aqueous solution. The paper will report on the dependence of creep corrosion on humidity in the 15 to 80% relative humidity range by testing ENIG (gold on electroless nickel), ImAg (immersion silver) and OSP (organic surface preservative) finished PCBs, soldered with organic acid flux.
Technical Library | 2019-05-24 07:26:39.0
Soldering system vendor SEHO runs a Technology Center in its headquarters in Germany, in which all available machines are exhibited and demonstrated. Additionally, the SEHO Academy provides knowledge as a perfect balance of theory and practical application. In both facilities soldering fume occurs, which has damaging effects on human health, manufacturing equipment and products. That's why the company had installed several air cleaning solutions in terms of fume extraction technology. How and why they take care of clean air is the subject of this article.
Technical Library | 2015-08-06 19:17:53.0
Fine pitch/fine feature solder paste printing in PCB assembly has become increasingly difficult as board geometries have become ever more compact. The printing process itself, traditionally the source of 70% of all assembly defects, finds its process window narrowing. The technology of metal blade squeegees, with the aid of new materials, understanding, and settings such as blade angle, has kept pace with all but the smallest applications, e.g., 200μ - .50 AR and 150μ - .375 AR, which have been pushing blade printing technology to its limits. Enclosed media print head technology has existed, and has been under increasing development, as an alternative to metal squeegee blade printing. Until recently, the performance of enclosed print heads had been comparable to the very best metal squeegees, but advances in enclosed print media technology have now made it a superior alternative to squeegee blades in virtually all applications.
Technical Library | 2023-10-19 22:03:14.0
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, proudly releases another customer success story with Matric Group. This case study shows how Matric Group has leveraged their partnership with Koh Young to be one of the first in the industry to use pre-reflow AOI as a game-changer for line efficiency and improved yield. All while creating a central inspection war room to allow just one person to manage all inline inspection, increasing automation, and control and mitigating talent shortages.
Technical Library | 2013-02-14 12:54:29.0
Boundary-scan (1149.1) technology was originally developed to provide a far easier method to perform digital DC testing to detect intra-IC interconnect assembly faults, such as solder shorts and opens. Today's advanced IC technology now includes high-speed differential interfaces that include AC or DC coupling components loaded on the printed circuit assembly. Simple stuck-at-high/low test methods are not sufficient to detect all assembly fault conditions, which includes shorts, opens and missing components. Improved diagnostics requires detailed circuit analysis, predictive assembly fault simulation and more complex testing to isolate and accurately detect all possible assembly faults... First published in the 2012 IPC APEX EXPO technical conference proceedings
Technical Library | 2016-08-02 06:12:05.0
The audio device industry is set to grow in parallel with the technology triggering across the globe. Also the entertainment and hospitality industry has created an increased demand of audio devices at large. With the enhancement coming up in consumer applications every other day, the recent trend of implementing wireless technology in audio devices has captivated the attention in the market with its growing popularities all over the electronics industry. The recent audio discoveries have marked cosmic developments in the new product launch, business partnership and acquisition globally. With this, the audio device makers are now in race to present a multi featured compact device with giving an appealing dimension experience to the end users in order to survive in the electronic market.
Technical Library | 2017-11-10 00:58:37.0
Modern electronics manufacturing is made up by a multiplicity of different separation and joining processes, with the later surely taking the vast majority of production technology. Alongside gluing, welding and laser processes, soldering still holds a primary position in electronic assemblies. However, soldering does not always equal soldering, because there are quite a lot of different soldering technologies. Accordingly, you have to distinguish between automated and manual soldering procedures. No matter which soldering process you analyse, all of them have one aspect in common: they produce airborne pollutants, which may have a negative impact on employees, plants and products as well.
