Technical Library | 2018-11-20 21:33:57.0
There are several industry-accepted methods for determining the reliability of flux residues after assembly. The recommended methods of test sample preparation do not always closely mimic the thermal cycle experienced by an assembly. Therefore, extraction from actual assemblies has become a popular method of process control to assess consistency of post-reflow cleanliness. Every method of post-reflow flux residue characterization will depend on the reflow process followed to prepare the coupon.This investigation will focus on the effect of thermal conditions on the remainder of active ingredients in flux residues after assembly with no-clean solder pastes.
Technical Library | 2009-07-09 17:23:07.0
Sometimes you just cannot clean with water. Good examples of this are: circuits with batteries attached, cleaning prior to encapsulation, ionic cleanliness testing, and non-sealed or other water sensitive parts. High impedance or high voltage circuits need to be cleaned of flux residues and other soils to maximize performance and reliability and, in these types of circuits; water can be just as detrimental as fluxes. When solvent cleaning is called for, Hansen solubility parameters can help target the best solvent or solvent blend to remove the residue of interest, and prevent degradation of the assembly being manufactured. In short, using this approach can time, manufacturing cost and reduce product liability.
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
Technical Library | 2023-04-25 22:03:25.0
This report hopes to achieve several goals: 1. Determine the link between bare PWB contamination, soldered assembly contamination and long-term product reliability. 2. Establish measurable limits for bare PWB cleanliness as well as process control limits for both an aqueous as well as a water-soluble soldering process. 3. Determine whether there is any correlation between common, industry-accepted rose/modified rose (omegameter/ionograph type) testing and long term product reliability. 4. Determine the effect PWB plating finish (HASL, Immersion Silver and Cu OSP) has on both bare PWB contamination as well as soldered assembly in a no clean and water soluble process. 5. Determine whether there is a link between percentage of saponifier used to wash soldered assemblies and long-term reliability. 6. Establish a more cost-effective test for manufacturers to use as a process-monitoring tool.
Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)
18220 Butterfield Blvd
Morgan Hill, CA USA
Phone: 5102268155
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