Technical Library | 2017-04-13 16:14:27.0
The drive to reduced size and increased functionality is a constant in the world of electronic devices. In order to achieve these goals, the industry has responded with ever-smaller devices and the equipment capable of handling these devices. The evolution of BGA packages and leadless devices is pushing existing technologies to the limit of current assembly techniques and materials.As smaller components make their way into the mainstream PCB assembly market, PCB assemblers are reaching the limits of Type 3 solder paste, which is currently in use by most manufacturers.The goal of this study is to determine the impact on solder volume deposition between Type 3, Type 4 and Type 5 SAC305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils. Leadless QFN and μBGA components will be the focus of the test utilizing optimized aperture designs.
Technical Library | 2016-04-08 01:19:52.0
PCB assembly designs become more complex year-on-year, yet early-stage form/fit compliance verification of all designed-in components to the intended manufacturing processes remains a challenge. So long as librarians at the design and manufacturing levels continue to maintain their own local standards for component representation, there is no common representation in the design-to-manufacturing phase of the product lifecycle that can provide the basis for transfer of manufacturing process rules to the design level. A comprehensive methodology must be implemented for all component types, not just the minority which happen to conform to formal packaging standards, to successfully left-shift assembly and test DFM analysis to the design level and thus compress NPI cycle times.(...)This paper will demonstrate the technological components of the working solution: the logic for deriving repeatable and standardized package and pin classifications from a common source of component physical-model content, the method for associating DFA and DFT rules to those classifications, and the transfer of those rules to separate DFM and NPI analysis tools elsewhere in the design-through-manufacturing chain resulting in a consistent DFM process across multiple design and manufacturing organizations.
Technical Library | 2010-06-24 21:20:05.0
Cost-effective assembly of custom-designed microelectromechanical systems (MEMS) for medium-caliber fuzes is challenging. In particular, the environment must have a setback acceleration exceeding 60,000g and centripetal acceleration of 9000g/mm out of center in a 30mm#2;173 projectile. In addition, the space available is very limited. The traditional approach is to mount the MEMS chip in a package that is then soldered to the printed circuit board (PCB). However, by mounting the MEMS chip directly to the PCB using conductive adhesive, we can increase the packaging density while reducing manufacturing cost.
Technical Library | 2013-09-22 02:52:56.0
The PCB-assembly industry in constantly changing. Smaller footprints, new types of components and larger and more complex designs are accompanied by constant competitive pressures. As a result, electronics manufacturers need to continuously adapt their processes and make sure they exploit every opportunity for efficiency gains. This is the only way to improve quality and time to market and to increase profitability.
Technical Library | 2023-11-14 19:42:24.0
Selective soldering is not a new process. It is already exists and used 30 years ago for through-hole component by different industries for automotive and medical products. Now most manufacturing industries are moving forward on SMD's miniaturization to reduce PCB complexity and balance component density on the board to ensure a good assembling process. By this concept, why selective soldering still utilized and used? Does it because of component reliability, uniqueness or complexity having this in mind next question will be which platform will best fit for the product
Technical Library | 2011-11-03 18:04:07.0
This paper presents the development of a novel vehicle-routing-based algorithm for optimizing component pick-up and placement on a collect-and-place type machine in printed circuit board manufacturing. We present a two-phase heuristic that produces soluti
Technical Library | 2015-07-21 13:50:37.0
Achieving an even coat at the right desired thickness is a major challenge when it comes to applying conformal coating to a Printed Circuit Board (PCB). Applying a coating too thin will ultimately render the electronic assembly vulnerable to potential environmental risks therefore defeating the purpose of the coating. Apply the coat too thick, and it could leave the electronic specific components non-functional therefore destroying the electronic assembly entirely. Coating thickness must meet quality specifications. Measurements for coating thickness may be taken while film is dry or wet. Once measurements are recorded, thickness is compared to quality specifications and fluid dispensing automation machinery is calibrated as necessary. There are a handful of methods for measuring conformal coating thickness that are commonly used in the Electronic Manufacturing Services (EMS) and Original Electronic Manufacturer (OEM) industries. A few commonly used methods for checking conformal coating thickness include:
Technical Library | 2015-05-28 17:34:48.0
The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.
Technical Library | 2023-11-06 17:08:44.0
A new process has been developed for RF shielding on compact electronic communications devices using automated solder paste dispensing. The process is known as Shield Edge Interconnect (SEI). SEI designs enable parts to be processed though underfill before placing of the RF shield and allows more complete use of valuable PCB real estate to achieve reduced form factor requirements and/or for added components on products such as smartphones and tablets. The reduced form factor creates challenges for the assembly of those devices. This process, enabled by Speedline dispensing technology, relies on extremely accurate dispensing of solder paste on copper traces located along the outer edge of the PCB. The result is a robust process solution for SEI in which proprietary closed loop dispenser, pump, vision, and software technologies enable a high volume manufacturing (HVM) process.
Technical Library | 2013-08-29 19:52:43.0
Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...
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