Technical Library | 2021-12-21 23:11:50.0
This paper cover the following points: - Objective 01: Preprocessing, - Introduction, - Objective 02: Automated FE Scripting, - Objective 03: Postprocessing, Reliability Analysis of PTHs, - Objective 03: Postprocessing, Manufacturability of Microvias
Technical Library | 2013-04-03 22:41:18.0
PLC vs PAC Difference & PAC Automation Controller Defined: This PLC vs PAC Difference article defines the PAC automation controller in relationship to the PLC. A PLC vs PAC comparison. Even more importantly, this article explains in great detail the need to differentiate when it comes to requesting and delivering PAC and/or PLC training.
Technical Library | 1999-08-05 09:34:44.0
This document demonstrates a sequential process of evaluating automated wafer instruments and discusses why this approach is useful for studying instruments that have automation features such as loading and focusing mechanisms. The methodology specifies a series of experiments consisting of two or more capability studies followed by a stability study. Each experiment achieves a separate goal, yet combines with the others in providing information needed to assess the usefulness of the instrument.
Technical Library | 2021-03-24 01:34:35.0
In this article we propose a generic test script for real=time embedded software system testing, which has been applied to ATE (Automated Test Equipment). After a summary of the theory about embedded software automated test based on test script, the design philosophy and implementation details are described. We have chosen an ATE and integrated python interpreter into it.
Technical Library | 2009-08-26 19:32:32.0
Automated optical inspection (AOI) and automated X-ray inspection (AXI) have been around for some time in various configurations and both have played a role in improving the quality of circuit boards. While some companies opt for one technology over the other, each form of inspection contributes its own unique benefit to the manufacturing process.
Technical Library | 2023-11-03 18:01:35.0
This case study explores the changing climate for manufacturing in Mexico as volumes and demand increase in the region and manufacturers, including IMI, look to grow through greater automation and closer collaboration with key technology partners like Koh Young. With interviews with Oscar Valdivia, IMI's Manufacturing Unit Manager for Guadalajara, and Philip Reyes, their Regional Engineering Head, the case study digs into how manufacturing excellence can be developed with the right use of automation and by investing in equipment that creates efficiency and quality through better use of accurate data.
Technical Library | 2016-06-23 13:24:56.0
Proper assembly of components is critical in the manufacturing industry as it affects functionality and reliability. In a heat sink assembly, a detailed manual process is often utilized. However, an automated fixture is used whenever applicable.This paper will illustrate the use of strain gauge testing and Finite Element Analysis (FEA) as a simulation tool to evaluate and optimize the heat sink assembly process by manual and automated methods. Several PCBAs in the production line were subjected to the manual and automated assembly process. Strain gauge testing was performed and FEA models were built and run. Results were compared with the goal of improving the FEA model. The updated FEA model will be used in simulating different conditions in assembly. Proposed improvement solutions to some issues can also be verified through FEA.
Technical Library | 2016-03-31 17:39:52.0
Electrical overstress causes damage to sensitive components, including latent damage. A significant source of EOS is high-frequency noise in automated manufacturing equipment. This paper analyses sources of such noise, how it affects components and how to mitigate this problem.
Technical Library | 2021-04-15 14:44:20.0
Automated inspection of surface mount PCB boards is a requirement to assure quality and to reduce manufacturing scrap costs and rework. This paper investigates methodologies for locating and identifying multiple objects in images used for surface mount device inspection. One of the main challenges for surface mount device inspection is component placement inspection.
Technical Library | 2021-12-20 14:29:10.0
The global building automation systems market is estimated to occupy a large amount of revenue by recording a CAGR of ~11% during the forecast period, i.e., 2022–2030, owing to the growing need for proper energy management across the globe, and increasing emphasis on overcoming utility costs.
