Technical Library | 2019-01-30 21:20:47.0
Due to the arrayed nature of the Computed Tomography (CT) Detector, high density area array interconnect solutions are critical to the functionality of the CT detector module. Specifically, the detector module sensor element, hereby known as the Multi-chip module (MCM), has a 544 position BGA area array pattern that requires precise test stimulation. A novel pogo-pin block array and corresponding motorized test socket has been designed to stimulate the MCM and acquire full functional test data. (...) This paper and presentation will focus on the socket design challenges and also key learnings from the design that can be applied to general test systems, including reliability testing. The secondary focus will be on the overall data collection and graphical user interface for the test equipment.
Technical Library | 2021-05-20 13:41:30.0
Adoption and integration of USB-C chargers and hubs in automotive applications is driving a need for an updated approach to production tests due to USB-C's connector density, high bandwidth, and high power. We introduce a new paradigm in test-system development, micro-FCT (micro Functional Test), and demonstrate developing and deploying of an end-of-line (EOL) functional test-system which meets the strict automotive test requirements for a USB-C hub. Specification to deployment of the test-system was completed in less than 10-weeks, and test cycle time was 1/10th of the customer's requirements
Technical Library | 2016-03-17 19:09:46.0
The rapid growth of electronic devices across the globe is driving manufacturers to enhance high-speed mass production techniques in the PCB assembly arena. As manufacturers drive to reduce costs while maximizing production by expanding facilities, updating automation equipment, or implementing lean six sigma techniques, the potential to build scrap product or rework printed circuit boards increases dramatically.Manufacturers have two general paths to reduce the costs of high-speed printed circuit board assembly production. The first path is to reduce cost by focusing on high quality printing and mounting. The other, increasingly popular option is to utilize low-cost materials. In either case, the baseline must provide a consistent high-speed solder paste printing method, which considers the fill, snap-off, and cleaning processes.Building on our expertise and testing, this paper will highlight the two trains of thought with specific focus on how low-cost materials affect print performance. It will also explore technologies, which can help provide stable, high-speed screen printing.
Technical Library | 2018-01-04 11:05:34.0
Traceability has grown from being a specialized need for certain safety critical segments of the industry, to now being a recognized value-add tool for the industry as a whole. The perception of traceability data collection however persists as being a burden that may provide value only when the most rare and disastrous of events take place. Disparate standards have evolved in the industry, mainly dictated by large OEM companies in the market create confusion, as a multitude of requirements and definitions proliferate. The intent of the IPC-1782 project is to bring the whole principle and perception of traceability up to date. Traceability, as defined in this standard will represent the most effective quality tool available, becoming an intrinsic part of best practice operations, with the encouragement of automated data collection from existing manufacturing systems, integrating quality, reliability, predictive (routine, preventative, and corrective) maintenance, throughput, manufacturing, engineering and supply-chain data, reducing cost of ownership as well as ensuring timeliness and accuracy all the way from a finished product back through to the initial materials and granular attributes about the processes along the way.
Technical Library | 2018-04-25 15:54:52.0
An automotive wire harness rarely has just a single part number that can be ordered and installed in a vehicle. Typically, there are many different versions of the same harness based on the orderable content in the vehicle. These versions (often called harness levels) will have unique part numbers. The quantity of these levels and their content is what is typically called complexity and it has a significant impact on the cost of the harness.Quantifying these costs is often very difficult especially with manual methods of deriving and costing the complexity solution. Therefore, traditionally, harness costing has focused on the piece cost of each harness level. When these complexity related costs are considered it is typically with overly simplified cost modeling techniques.This paper will focus on the quantification of these complexity related costs so that they can be modeled allowing automated algorithms to optimize for these costs. A number of real world examples will be provided as well. Since no two businesses are alike, it is the aim of this paper to provide the foundational knowledge and methodology so the reader can assess their own business to model how variation complexity costs affect their business.
Technical Library | 2020-03-04 23:53:17.0
Critical to maintaining quality control in high-throughput screening is the need for constant monitoring of liquid-dispensing fidelity. Traditional methods involve operator intervention with gravimetric analysis to monitor the gross accuracy of full plate dispenses, visual verification of contents, or dedicated weigh stations on screening platforms that introduce potential bottlenecks and increase the plate-processing cycle time. We present a unique solution using open-source hardware, software, and 3D printing to automate dispenser accuracy determination by providing real-time dispense weight measurements via a network-connected precision balance. This system uses an Arduino microcontroller to connect a precision balance to a local network. By integrating the precision balance as an Internet of Things (IoT) device, it gains the ability to provide real-time gravimetric summaries of dispensing, generate timely alerts when problems are detected, and capture historical dispensing data for future analysis. All collected data can then be accessed via a web interface for reviewing alerts and dispensing information in real time or remotely for timely intervention of dispense errors. The development of this system also leveraged 3D printing to rapidly prototype sensor brackets, mounting solutions, and component enclosures.
Technical Library | 2021-08-04 18:46:25.0
The process of printed circuit board assembly (PCBA) involves several machines, such as a stencil printer, placement machine and reflow oven, to solder and assemble electronic components onto printed circuit boards (PCBs). In the production flow, some failure prevention mechanisms are deployed to ensure the designated quality of PCBA, including solder paste inspection (SPI), automated optical inspection (AOI) and in-circuit testing (ICT). However, such methods to locate the failures are reactive in nature, which may create waste and require additional effort to be spent re-manufacturing and inspecting the PCBs. Worse still, the process performance of the assembly process cannot be guaranteed at a high level. Therefore, there is a need to improve the performance of the PCBA process. To address the aforementioned challenges in the PCBA process, an intelligent assembly process improvement system (IAPIS) is proposed, which integrates the k-means clustering method and multi-response Taguchi method to formulate a pro-active approach to investigate and manage the process performance.
Technical Library | 2009-05-14 13:57:43.0
Is screen printing technology able to keep pace with rising quality demands and increasingly complex board layouts? Or, is new jet printing technology ready to fill the gap? A comparison study between the two methods reveals some interesting differences. Screen printers offer some possibilities for optimizing solder paste deposits, but optimization is far easier and quicker with the jet printer. At the same time, the ability to print individualized deposits on every single pcb pad may be the ultimate answer to the growing quality challenge.
Technical Library | 2019-05-23 21:56:56.0
Automatic on-line shoe sole spraying system: automatic shoe sole spraying system, simple and convenient operation, using 3D vision positioning system. Automatic recognition and automatic generation of spraying trajectory. Robot non-contact spraying gun is used to complete the process of shoe sole spraying with maturity, stability, high speed and high precision along the predetermined trajectory. The automatic generation of spraying trajectory is the realization of shoe sole spraying technology. Shoe sole spraying characteristics: 1.Positioning System: 3D Visual Positioning 2.Components: Intelligent Robot, Laser Scanner, Industrial Computer, Gum Spraying System, Conveyor Belt, Electrical Control System, etc. 3.Spraying time: slightly different according to shoe size and spraying time Fully automatic sole spraying advantages: 1. Simple application: suitable for soles of different specifications, models and sizes 2. Faster speed: 6-8 seconds to complete sole scanning and spraying, superior to similar products at home and abroad. 3. Quality stability: gum spraying trajectory is scheduled, gum dosage is fixed, gum spraying quality is greatly improved. 4. High cost performance: the same performance, the price is only 1/3 of the same type of equipment of European brand. 5. Reduce wear and tear: glue is fully utilized and not wasted, reducing human contact with glue. Intelligent operation advantage manual only need general operation can be automated workshop, mechanical arm automatic spraying glue, accurate spraying, reduce glue waste. Environmental protection effect of long-term close contact with glue seriously affects human health and mechanical work, glue does not directly contact, do not harm the human body. Fully automatic spraying, shoe sole adhesion process for automatic spraying machine, will not cause great challenges! With the deepening of personalized shoemaking, higher requirements have been put forward for the spraying technology in shoemaking process. The method of creating spraying trajectory must be adapted to shoes of different sizes and styles. The automatic generation of spraying trajectory is one of the key technologies to realize the automation of shoe sole spraying process. The method of off-line programming and real-time generation of spraying trajectory for robots based on the three-dimensional CAD model of sole and the data of sole. A new method of generating spray trajectory by scanning the sole of shoe upper with linear structured light sensor is presented. The feasibility of the method is verified by industrial robots. Aiming at the need of generating shoe sole spray rubber trajectory based on line structured light, the format standard of IGES file of three-dimensional model of shoe sole was tested. The shoe sole contour line and the shoe sole surface were extracted, and then the offset curve of the shoe sole contour line on the shoe sole surface was calculated to obtain the spray rubber trajectory. Three-dimensional profilometer is to use structured light to obtain sole information, effectively improve the automatic shoemaking spraying process, which will help to improve the efficiency of shoemaking, improve the quality of footwear products, and promote the development of personalized shoemaking.
Technical Library | 2009-11-18 23:37:52.0
Accurate component placement is a basic requirement for any pick and place machine. The first step towards accurate placement is accurate centering, or measurement of the component’s position on the placement head. One of the most widely used centering methods for ICs, connectors, and odd‐shaped components are a camera based system that measures the component position relative to a known point. Camera based centering systems include three main elements: lighting, camera, and software. Each of these elements are critical to obtaining an accurate measurement of the component and ultimately for accurate component placement on the PCB. As the old adage goes, the system is only as strong as its weakest link.
