Technical Library | 2023-08-16 18:48:50.0
One of our aerospace customers was looking to automate a few manual operations and asked for suggestions. This customer specializes in assemblies for inflight connectivity for commercial airlines and low orbit satellites. The dispensing process included the application of bonding to the sides of large and small components (4-axis) and the ability to cope with the changing viscosity during processing. The material used was EC-2216 B/A Two Part Epoxy and the largest board size was 12"x10"
Technical Library | 2024-08-27 06:17:52.0
销售经理 电子邮件 WhatsApp Skype 乌娜 sales5@mooreplc.com 86-15359408275 +8615359408275 品牌/制造商： ◤ PU515A 3BSE032401R1 ◥ PU515A 的特性： MB300 双运河：使用 MB300 协议进行通信的运河，可能会连接到其他控制系统。 密码：PU515A 的最终目的是实现 PU515、PU518 或 PU519 的前模型。 由于 USB 端口：RTA 与其他表的区别，PU515A 不包括 USB 端口。 为什么选择我们 1.100％原装产品，100％质量保证，价格更具竞争力。 如果您发现假货，请立即联系我们！我们承担运费！我们将免费为您寄送新产品！ 2.周到的服务 专业的售后服务。 3. 快速发货 我们有大量库存，可以立即发货。 推荐型号 本利内华达 330500-01-04 普罗软件 MVI94-MCM 本利内华达 330780-50-00 霍尼韦尔 05701-A-0301 本利内华达 330104-00-06-10-02-00 霍尼韦尔 FC-电源-UNI2450U 本利内华达 9571-50 普罗软件 MVI46-MNET 本利内华达 177230-00-01-05 霍尼韦尔 05704-A-0135 本利内华达 330180-51-CN ICS T8110B 通用电气 IC697ACC701 伍德沃德 8273-1011 本利内华达 136188-02 ABB HIEE300867R0001 PPB022 DE01 通用电气 IC695ETM001 特利科奈斯 3603E 易宝 PR6424/000-030 CON021 霍尼韦尔 51198685-100 SPS5710-2-LF 霍尼韦尔 CC-TUIO31 51306875-176 通用电气 DS200PTCTG1BAA 福克斯堡 FBM201 P0914SQ 通用电气 UR8LH 通用电气 IS210HSLAH1ADE 霍尼韦尔 CC-PAIH02 51405038-375 霍尼韦尔 51198947-100F 易宝 PR9268/200-000
Technical Library | 2016-09-22 17:52:59.0
Conformal Coatings are often used to increase the reliability of electronic assemblies operating in harsh or corrosive environments where the product would otherwise fail prematurely. Conformal coatings are often qualified to international standards, intended to enable users to better differentiate between suitable conformal coating chemistries, but always on a flat test coupon, which is not representative of real world use conditions. In order to better correlate international standards with real world-use conditions, three-dimensional Surface Insulation Resistance (SIR) test boards have been manufactured with dummy components representative of those commonly used on printed circuit assemblies...
Technical Library | 2021-07-20 20:02:29.0
During the manufacturing of printed circuit boards (PCBs) for a Flight Project, it was found that a European manufacturer was building its boards to a European standard that had no requirement for copper wrap on the vias. The amount of copper wrap that was measured on coupons from the panel containing the boards of interest was less than the amount specified in IPC-6012 Rev B, Class 3. To help determine the reliability and usability of the boards, three sets of tests and a simulation were run. The test results, along with results of simulation and destructive physical analysis, are presented in this paper. The first experiment involved subjecting coupons from the panels supplied by the European manufacturer to thermal cycling. After 17 000 cycles, the test was stopped with no failures. A second set of accelerated tests involved comparing the thermal fatigue life of test samples made from FR4 and polyimide with varying amounts of copper wrap. Again, the testing did not reveal any failures. The third test involved using interconnect stress test coupons with through-hole vias and blind vias that were subjected to elevated temperatures to accelerate fatigue failures. While there were failures, as expected, the failures were at barrel cracks. In addition to the experiments, this paper also discusses the results of finite-element analysis using simulation software that was used to model plated-through holes under thermal stress using a steady-state analysis, also showing the main failure mode was barrel cracking. The tests show that although copper wrap was sought as a better alternative to butt joints between barrel plating and copper foil layers, manufacturability remains challenging and attempts to meet the requirements often result in features that reduce the reliability of the boards. Experimental and simulation work discussed in this paper indicate that the standard requirements for copper wrap are not contributing to the overall board reliability, although it should be added that a design with a butt joint is going to be a higher risk than a reduced copper wrap design. The study further shows that procurement requirements for wrap plating thickness from Class 3 to Class 2 would pose little risk to reliability (minimum 5 μm/0.197 mil for all via types).Experimental results corroborated by modeling indicate that the stress maxima are internal to the barrels rather than at the wrap location. In fact, the existence of Cu wrap was determined to have no appreciable effect on reliability.
Technical Library | 2014-11-13 19:23:50.0
With increasing power loss of electrical components, thermal performance of an assembled device becomes one of the most important quality factors in electronic packaging. Due to the rapid advances in semiconductor technology, particularly in the regime of high-power components, the temperature dependence of the long-term reliability is a critical parameter and has to be considered with highest possible care during the design phase (...) The aim of this paper is to give a short overview about standard thermal solutions like thick copper, thermal vias, plugged vias or metal core based PCBs. Furthermore, attention will be turned on the development of copper filled thermal vias in thin board constructions...
Technical Library | 2007-09-27 16:18:15.0
Considerable interest exists in the process known as the pinin- paste, or the Alternative Assembly and Reflow Technology (AART) process. The AART process allows for the simultaneous reflow of both odd-form and through hole devices as well as surface mount components. This process has several advantages over the typical mixed technology process sequence that includes wave soldering and/or hand soldering, often in addition to reflow soldering.
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