Technical Library: basing (Page 5 of 19)

Printed Circuit Board (PCB) Technology for Electrochemical Sensors and Sensing Platforms

Technical Library | 2021-02-17 22:13:39.0

The development of various biosensors has revolutionized the healthcare industry by providing rapid and reliable detection capability. Printed circuit board (PCB) technology has a well-established industry widely available around the world. In addition to electronics, this technology has been utilized to fabricate electrical parts, including electrodes for different biological and chemical sensors. High reproducibility achieved through long-lasting standard processes and low-cost resulting from an abundance of competitive manufacturing services makes this fabrication method a prime candidate for patterning electrodes and electrical parts of biosensors. The adoption of this approach in the fabrication of sensing platforms facilitates the integration of electronics and microfluidics with biosensors. In this review paper, the underlying principles and advances of printed board circuit technology are discussed. In addition, an overview of recent advancements in the development of PCB-based biosensors is provided. Finally, the challenges and outlook of PCB-based sensors are elaborated. doi:10.3390/bios10110159

Louisiana State University

An Experimental Investigation of Fracture Toughness and Volume Resistivity of Symmetric Laminated Epoxy/ Glass Fiber/CNT multiscale composites

Technical Library | 2022-01-26 15:26:56.0

In this work an attempt is made to improve the fracture toughness and electrical conductivity of epoxy/glass fiber based laminates by the inclusion of carbon nanotube (CNT) fillers. The fiber orientation of the epoxy/ glass fiber (GF) fabric laminates was optimized based on estimation of mechanical properties. The carboxylic acid functionalized CNTs were incorporated into epoxy matrix by ultra-sonication method. The nano filled epoxy resin was used to prepare laminates with 30/45 GF fabric orientation. The CNT content was varied and its effect on the tensile properties was determined. The fracture toughness of multiphase composites was estimated using single edge notch bend (SENB) test. The presence of CNTs improved the fracture toughness by a crack bridging mechanism. The volume resistivity of multiphase composites was found to be superior to the conventional epoxy/CNT composite. The presence of glass fabric reduces the number of inter-tube contacts contributing to the reduction in volume resistivity.

Amrita University

Laser Micromachining of Nanocomposite-Based Flexible Embedded Capacitors

Technical Library | 2007-11-21 11:39:13.0

This paper discusses laser micromachining of barium titanate (BaTiO3)-polymer nanocomposites and sol-gel thin films. In particular, recent developments on high capacitance, large area, and thin flexible embedded capacitors are highlighted.

i3 Electronics

SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control

Technical Library | 2009-02-13 12:29:39.0

To meet the market demand for a best-in-class, low-cost leadfree alloy for wave, selective and dip soldering

Kester

Color Based Printed Circuit Board Solder Segmentation

Technical Library | 2010-09-30 21:07:29.0

As technology is much more advanced nowadays, electronic devices are ubiquitous in our daily life. PCB (Printed Circuit Board) plays an important role in almost every modern electronic device. However, there still is not a perfect PCB manufacturing proces

National Taiwan University

Defect-Based Test: A Key Enabler for Successful Migration to structural test

Technical Library | 1999-05-06 14:39:20.0

ntelís traditional microprocessor test methodology, based on manually generated functional tests that are applied at speed using functional testers, is facing serious challenges due to the rising cost of manual test generation and the increasing cost of high-speed testers. If current trends continue, the cost of testing a device could exceed the cost of manufacturing it. We therefore need to rely more on automatic test pattern generation (ATPG) and low-cost structural testers.

Intel Corporation

Flexible Hybrid Circuit Fully Inkjet-Printed: Surface Mount Devices Assembled By Silver Nanoparticles-Based Inkjet Ink

Technical Library | 2018-06-27 16:47:13.0

Nowadays, inkjet-printed devices such as transistors are still unstable in air and have poor performances. Moreover, the present electronics applications require a high degree of reliability and quality of their properties. In order to accomplish these application requirements, hybrid electronics is fulfilled by combining the advantages of the printing technologies with the surface-mount technology. In this work, silver nanoparticle-based inkjet ink (AgNP ink) is used as a novel approach to connect surface-mount devices (SMDs) onto inkjet-printed pads, conducted by inkjet printing technology

Universitat de Barcelona

Kaphesion VSI Parylenes solution to Polyimide Adhesion

Technical Library | 2017-04-13 10:57:53.0

Parylene has been used for decades as a barrier layer to protect critical devices and components. The parylene deposition process typically requires an adhesion promotion step to make sure the parylene adheres well to the base substrate. Typical adhesion methods don't work well on Kapton and Polyamide, until VSI Parylene came up with a solution.

VSI Parylene

How to optimize dispensing processes

Technical Library | 2024-03-20 13:37:18.0

Effective and reliable dispensing is based primarily on process technology that has been perfectly set up for the specific project. Anyone tasked with planning dispensing systems and responsible for the processes should know the principles and key factors involved so that the dispensing processes can be successfully implemented in cooperation with system and material partners. This White Paper explains the relevant aspects of process technology and provides valuable practical tips.

Scheugenpflug Inc.

SOMABLACK

Technical Library | 2024-06-28 21:22:38.0

SOMABLACK, produced by Somar Corporation, is rapidly becoming the top choice for many applications that require low to zero light reflectivity. It is a polyester-based material, mixed with black carbon to create something that both shades light and reduces reflection, while also having excellent dimensional stability. It is available in a range of options, with varying thicknesses, specular glossiness, optical density, and coatings.

A-Laser, Inc.


basing searches for Companies, Equipment, Machines, Suppliers & Information

SMTAI 2024 - SMTA International

Component Placement 101 Training Course
Electronics Equipment Consignment

High Throughput Reflow Oven
2024 Eptac IPC Certification Training Schedule

Training online, at your facility, or at one of our worldwide training centers"
2024 Eptac IPC Certification Training Schedule

World's Best Reflow Oven Customizable for Unique Applications
Fully Automatic BGA Rework Station

Low-cost, self-paced, online training on electronics manufacturing fundamentals