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SMT Stencil Design And Consideration Base on IPC

Technical Library | 2010-03-23 11:50:22.0

This document discuss how to design SMT stencil base on IPC-7525. Introduction: PCBA (Printed Circuit Board Assembly) is a segment of printed circuit board technology. This segment of printed circuit board industry is concentrated in assemble all the pieces of electronic industry to one piece before output them to market. This segment covers: interconnection technology, package design technology, system integration technology, board and system test technology

Association Connecting Electronics Industries (IPC)

Virtual Manufacturing

Technical Library | 2019-09-16 09:41:02.0

“What is Virtual Manufacturing?” The simplest answer is a manufacturing simulation using a computer. The more complete answer is that virtual manufacturing is the process of designing a model of a real system and conducting experiments with this model for the purpose of understanding the behavior of the system. In today’s complex manufacturing environment, processes must be completely understood before implementation in order to “get it right the first time.” To achieve this goal, the use of a virtual environment is essential for simulating individual manufacturing processes and the total manufacturing system. By driving compatibility between the product design and the assembly plant process, these virtual tools enable the early optimization of cost, quality, and time to help achieve integrated products, process and resource design, and affordability.

ACI Technologies, Inc.

Non-Destructive Test Methods

Technical Library | 2019-09-23 09:35:00.0

Failure analysis (FA), by its very nature, is needed only when things goawry. Before any testing is performed on the sample, a decision mustbe made as to whether or not the sample is allowed to be destroyedin the process of testing. Non-destructive testing can allow for re-use of the assembly since the functionality is not altered, but there still remains the possibility that inadvertent damage can occur through the course of the analysis. If non-destructive testing is preferred, then the following types of analysis can be performed. The testing can be divided into four categories: visual, X-ray (X-ray imaging and X-ray fluorescence), cleanliness (resistivity of solvent extract, ion chromatography, and Fourier transform infrared spectroscopy), and mechanical (non-destructive wire bond pull).

ACI Technologies, Inc.

Guidelines/recommendations "Drying of PCBs before soldering"

Technical Library | 2024-02-05 17:51:01.0

Objective:  Drying = reducing the humidity in PCB before soldering  Preventing delamination caused by thermal stress after moisture absorption Methods:  Drying in convection and/ or vacuum oven  Parameters subject to material type, soldering surface, layer count, time to soldering, layout (copper-plated areas)

ZVEI - German Electro and Digital Industry Association

How to choose the plug of anti static IC tube and its material

Technical Library | 2019-05-09 05:40:52.0

When the anti static ic tube is produced, it is empty at both ends. Therefore, before and after the electronic components are loaded into the plastic tube, the IC hoses need to be blocked at both ends. Generally, there are plastic nails and rubber stoppers.

Shenzhen Sewate Technology Co.,Ltd

The Environmental Cost of Green

Technical Library | 2009-09-30 23:12:29.0

Being involved in the electronics assembly industry for more than 23 years, specifically in the field of defluxing and cleanliness testing, I have seen my share of environmental regulations. Long before the debate over lead-free alloys, there was the Montreal Protocol.

Aqueous Technologies Corporation

RoHS: Five Years Later

Technical Library | 2011-12-01 16:57:22.0

Are electronics any “greener” than before RoHS? It is a fair question to ask. With the advent of RoHS on July 1, 2006, and more recently REACH, one might be inclined to answer that it is greener than it was. We will take a look at this question in several

Indium Corporation

Three-Dimensional MMIC and Its Evolution to WLCSP Technology

Technical Library | 2012-01-19 19:14:49.0

The history of multilayered, three-dimensional monolithic microwave integrated circuit (3-D MMIC) technology is described here. Although significant researches were carried out in the second half of 1990’s, still there were many twists and turns before an

Sumitomo Electric Industries, Ltd.

Potting And Encapsulating – Avoiding Voids

Technical Library | 2021-08-11 00:52:35.0

Formulators of multi-component adhesives, potting and encapsulation materials are careful not to supply products with entrapped air. They do this by manufacturing under vacuum or degassing them before supplying to the end user. Consequently, entrapped air in a mixed material is usually a processing issue.

Intertronics

I Have an Idea for a New Product, but Now What?

Technical Library | 2007-03-13 14:31:11.0

Do you have an idea for an electronic product, the next must-have gadget, music or video system, time saver, or the greatest problem-solving device that was ever invented? Before you begin designing the product, there are a number of tasks that you must complete and issues that you must resolve before you have an actual product design that can be produced, marketed, and sold. This article will provide you with some guidelines to assist you in getting your idea turned into a successful design. Other issues, such as whether or not to apply for a patent for your product idea and in detail how a particular product should be advertised or marketed will not be addressed in this article.

Innovative Circuits Inc.

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