Technical Library | 2015-08-27 15:32:16.0
Ever since there has been a widespread usage of surface mount parts, the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework of same. Todays' pitches are commonly 0.5 to 0.4mm with packages of tiny outline sizes, 5 -10mm square, making the rework of such devices a challenge. In addition to the handling and inspection challenges comes the board density. Spacing to neighboring components continues to be compressed so the rework techniques should not damage neighboring components.
Technical Library | 2017-03-30 18:34:52.0
There are multiple methods, each with its associated benefits for given applications, for printing either solder paste or paste flux for BGA rework. Each of these methods is best-suited for a given situation, board layout and skill level of operators performing the BGA rework. This discussion will layout the various methods and present the specific circumstances for which the specific technique is most wellsuited. In addition, the pluses and minuses for each of the approaches will be discussed in detail.
Technical Library | 2013-07-03 10:31:54.0
It has been demonstrated in numerous pieces of work that stencil printing, one of the most complex PCB assembly processes, is one of the largest contributors to defects (Revelino et el). This complexity extends to prototype builds where a small number of boards need to be assembled quickly and reliably. Stencil printing is becoming increasingly challenging as packages shrink in size, increase in lead count and require closer lead spacing (finer pitch). Prototype SMT assembly can be further divided between industrial and commercial work and the DIYer, hobbyist or researcher groups. This second group is highly price sensitive when it comes to the materials used for the board assembly as their funds are sourced from personal or research monies as opposed to company funds. This has led to development of a lower cost SMT printing stencil made from plastic film as opposed to the more traditional stainless steel stencil used by industrial and commercial users.This study compares the performance of these two traditional materials and their respective impact on solder paste printing including efficiency and print quality.
Technical Library | 2019-05-29 23:10:30.0
There are times when a PCB prototype needs to be built quickly to test out a design. In such cases where it is known early on that there will be multiple iterations or that a "one and done" assembly will be made that there will be some SMT assemblers who choose to hand print solder paste onto the board using a "frameless" stencil. In such cases where hand printing is used, the consistency of the printing technique has typically been in question. Furthermore, the effectiveness of both the nanocoatings as well as the higher end stainless steel materials, which have been heretofore studied in controlled printing environments, will be evaluated for their impact on the hand printing process.The purpose of the study was to determine the effectiveness of select nanocoating materials as well as certain high end stainless steel stencil materials as they relate to the manual SMT printing process. A variety of nanocoatings were applied to SMT metal stencils and solder paste volume measurements were taken to compare the effectiveness.
Technical Library | 2024-08-27 06:17:52.0
销售经理 电子邮件 WhatsApp Skype 乌娜 sales5@mooreplc.com 86-15359408275 +8615359408275 品牌/制造商： ◤ PU515A 3BSE032401R1 ◥ PU515A 的特性： MB300 双运河：使用 MB300 协议进行通信的运河，可能会连接到其他控制系统。 密码：PU515A 的最终目的是实现 PU515、PU518 或 PU519 的前模型。 由于 USB 端口：RTA 与其他表的区别，PU515A 不包括 USB 端口。 为什么选择我们 1.100％原装产品，100％质量保证，价格更具竞争力。 如果您发现假货，请立即联系我们！我们承担运费！我们将免费为您寄送新产品！ 2.周到的服务 专业的售后服务。 3. 快速发货 我们有大量库存，可以立即发货。 推荐型号 本利内华达 330500-01-04 普罗软件 MVI94-MCM 本利内华达 330780-50-00 霍尼韦尔 05701-A-0301 本利内华达 330104-00-06-10-02-00 霍尼韦尔 FC-电源-UNI2450U 本利内华达 9571-50 普罗软件 MVI46-MNET 本利内华达 177230-00-01-05 霍尼韦尔 05704-A-0135 本利内华达 330180-51-CN ICS T8110B 通用电气 IC697ACC701 伍德沃德 8273-1011 本利内华达 136188-02 ABB HIEE300867R0001 PPB022 DE01 通用电气 IC695ETM001 特利科奈斯 3603E 易宝 PR6424/000-030 CON021 霍尼韦尔 51198685-100 SPS5710-2-LF 霍尼韦尔 CC-TUIO31 51306875-176 通用电气 DS200PTCTG1BAA 福克斯堡 FBM201 P0914SQ 通用电气 UR8LH 通用电气 IS210HSLAH1ADE 霍尼韦尔 CC-PAIH02 51405038-375 霍尼韦尔 51198947-100F 易宝 PR9268/200-000
Technical Library | 2024-08-27 08:07:50.0
SNAT7030 SNAT 7030 circuit board Una Xu Skype:+8615359408275 WhatsApp:+8615359408275 Telephone:+8615359408275 Email:sales5@mooreplc.com WeChat:15359408275
Technical Library | 2021-08-31 03:26:45.0
Test plan for refrigerator main board
Technical Library | 2012-12-26 20:18:50.0
①Single side The basic flexible printed circuit board is used of substrate of single side pcb materials and coated coverlay after finishing printed. ②Double sided That is made of substrates of double sided printed circuit board with double surface coated coverlays after finishing printed. ③Single copper foil with double coverlays Single copper foil coated different coverlays with double surface after finishing printed. ④Air gap Laminating two single printed circuit board together with no glue and bare design to meet high flexibility requirements. ⑤Multilayer That is designed for three and above circuit layers by laminating single side printed circuit board or double sided printed circuit board. ⑥COF IC chips and electronic components are installed on the flexible circuit board directly. ⑦Rigid-Flexible PCB Combined to rigid PCB with supporting and flexible PCB with high flexibility.
Technical Library | 2020-11-19 10:15:54.0
How to repair boards if they have been produced for a long time, and the documentation is lost? In this case, intelligent recognition systems can help, which will allow you to identify component pins without documentation for the board. In this article, we will find the STM32F429 board malfunctions without any documentation and in the least amount of time.
Technical Library | 2015-01-12 09:27:49.0
V2V is a collision avoidance technology that transmits data between vehicles to help warn drivers of potential crashes. This technology would improve safety by allowing vehicles to communicate with each other and exchange basic safety data, such as position and speed and warn the driver of potentially dangerous situations.
