Technical Library | 2020-05-26 22:28:56.0
Both the number and the variants of Ball Grid Array packages (BGAs) are tending to increase on network Printed Board Assemblies (PBAs)with sizes ranging from a few mm die size Wafer Level Packages (WLPs) with low ball count up to large multi-die System-in-Package (SiP) BGAs with 60-70 mm side lengths and thousands of I/Os.
Technical Library | 1999-05-07 08:50:40.0
To enable transistor scaling into the 21st century, new solutions such as high dielectric constaConventional scaling of gate oxide thickness, source/drain extension (SDE), junction depths, and gate lengths have enabled MOS gate dimensions to be reduced from 10mm in the 1970’s to a present day size of 0.1mm. To enable transistor scaling into the 21st century, new solutions such as high dielectric constant materials for gate insulation and shallow, ultra low resistivity junctions need to be developed. In this paper, for the first time, key scaling limits are quantified for MOS transistorsnt materials for gate insulation and shallow, ultra low resistivity junctions need to be developed.
Technical Library | 2020-07-15 18:29:34.0
In the early 2000s the first fine-pitch ball grid array devices became popular with designers looking to pack as much horsepower into as small a space as possible. "Smaller is better" became the rule and with that the mechanical drilling world became severely impacted by available drill bit sizes, aspect ratios, and plating methodologies. First of all, the diameter of the drill needed to be in the 0.006" or smaller range due to the reduction of pad size and spacing pitch. Secondly, the aspect ratio (depth to diameter) became limited by drill flute length, positional accuracy, rigidity of the tools (to prevent breakage), and the throwing power of acid copper plating systems. And lastly, the plating needed to close up the hole as much as possible, which led to problems with voiding, incomplete fill, and gas/solution entrapment.
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