Technical Library | 2022-04-26 03:27:56.0
The naming of the chip capacitor: The parameters included in the name of the chip capacitor include the size of the chip capacitor, the material used for this chip capacitor, the required accuracy, the required voltage, the required capacity, the requirements of the terminal and packaging requirements. Generally, the parameters to be provided for ordering a chip capacitor should be the size, the required accuracy, the voltage requirement, the capacity value, and the required brand.
Technical Library | 2022-04-27 01:34:43.0
SMD capacitors and resistors have small sizes and many models. Some manufacturers buy a lot of products and do not use them up in time. The problem of storage is always a headache. So how should chip capacitors and resistors be stored? There are also precautions when using chip capacitors. Please see the following information and hope it will help you.
Technical Library | 2022-04-28 06:42:19.0
I. Chip capacitors(MLCC) The full name of chip capacitors: multilayer (multilayer, laminated) chip ceramic capacitors, also known as chip capacitors, chip capacitance.
Technical Library | 2011-04-14 15:29:39.0
Multilayer Ceramic Capacitors (MLCC) come in a broad range of sizes, geometries, and values, offering design engineers with many options for designing circuits. In many cases these MLCC’s offer advantages over other types of capacitors including low ESR/E
Technical Library | 2015-01-22 17:32:27.0
Temperature requirements for ceramic capacitors have increased significantly with recent advances in deep-well drilling technology. Increasing demand for oil and natural gas has driven the technology to deeper and deeper deposits resulting in extreme temperature environments up to 200°C and above. A novel capacitor solution utilizing temperature-stable base-metal electrode capacitors in a molded and leaded package addresses the growing market high temperature demands of (1) capacitance stability, (2) long service life, and (3) mechanical durability. A range of high temperature C0G capacitors capable of meeting this 200°C and above high temperature environment has been developed. This paper will review the electrical, reliability, and mechanical performance of this new capacitor solution
Technical Library | 2015-05-21 18:46:31.0
In this work the reliability of an embedded planar capacitor laminate under temperature and voltage stress is investigated. The capacitor laminate consisted of an epoxy-BaTiO3 composite sandwiched between two layers of copper. The test vehicle with the embedded capacitors was subjected to a temperature of 125oC and a voltage bias of 200 V for 1000 hours. Capacitance, dissipation factor, and insulation resistance were monitored in-situ. Failed capacitors exhibited a sharp drop in insulation resistance, indicating avalanche breakdown. The decrease in the capacitance after 1000 hours was no more than 8% for any of the devices monitored. The decrease in the capacitance was attributed to delamination in the embedded capacitor laminate and an increase in the spacing between the copper layers.
Technical Library | 1999-05-06 12:08:08.0
Input voltage capacitors are typically the parts that fail first in a high power circuit. Today's requirements for increasingly smaller packages is driving high component densities in power systems, as in all systems. As the package size...
Technical Library | 2007-11-21 11:39:13.0
This paper discusses laser micromachining of barium titanate (BaTiO3)-polymer nanocomposites and sol-gel thin films. In particular, recent developments on high capacitance, large area, and thin flexible embedded capacitors are highlighted.
Technical Library | 2011-12-15 17:21:42.0
manganese dioxide or conductive polymer cathode. Higher stability is achieved by placement of the capacitor into an SMD case filled by an inert atmosphere and hermetically sealed. The long term stability testing performed on such hermetically sealed capac
Technical Library | 2008-10-23 15:36:58.0
As part of continuous process improvement at KEMET, most failure modes caused by the capacitor manufacturing process have been systematically eliminated. Today these capacitor manufacturing-related defects are now at a parts per billion (PPB) level. Pareto analysis of customer complaints indicates that the #1 failure mode is IR failure due to flex cracks.
