Technical Library | 2023-11-22 09:17:49.0
In the dynamic realm of Industry 4.0, I.C.T introduces the I.C.T-T550 SMT PCB coating machine, a pioneering addition designed to meet the evolving needs of modern manufacturing. This advanced equipment is equipped with features that not only boost productivity but also prioritize precise and consistent coating quality. Let's delve into the crucial attributes that establish the I.C.T-T550 as a vital component in your production process. 1. Automated Precision for Coating Consistency The I.C.T-T550 PCB Coating Machine integrates an automated pressure regulation system for both dispensing valve and pressure tank, equipped with precision regulators and digital gauges. This ensures a consistent coating process, optimizing precision. 2. Front-End Accessibility for Operational Efficiency Located at the front end, power supply and air pressure adjustments are easily accessible, streamlining control. This user-friendly design enhances operator workflow efficiency. 3. Durable Material Transport The open-material transport rail undergoes hardening treatment and utilizes a specialized stainless steel chain drive, ensuring both longevity and reliable material transport. 4. Track Width Adjustment for Trouble-Free Operation Track width adjustment is achieved through a synchronous belt drive mechanism, ensuring prolonged and trouble-free operation. 5. CNC Machined Frame for Unparalleled Precision The machine's frame, subjected to CNC machining, features an independent, all-steel gantry frame, ensuring the parallel alignment of tracks and axes. 6. Workshop Environment Enhancement To ensure a cleaner and safer workspace, the equipment features air curtains at the track entrance and exit, preventing fumes from escaping. It also includes a dedicated exhaust outlet, improving overall workshop air quality. 7. Intuitive Programming and Visualization The I.C.T-T550 PCB Coating Machine allows flexible coating path editing through intuitive programming. The equipment employs a teach mode for programming, offering a visual interface for coating path design. 8. User-Friendly Interface with Practical Design Featuring a user-friendly interface with fault alerts and menu displays, the I.C.T-T550 delivers a sleek and practical design. 9. Streamlined Repetition and Data Management Efficiency is paramount, and the I.C.T-T550 offers the ability to mirror, array, and replicate coating paths, simplifying the process, especially with multiple boards. 10. Real-Time Data Monitoring The equipment automatically collects and displays data, including production volume and individual product work times, enabling effective production performance tracking. 11. Smart Adhesive Management The I.C.T-T550 intelligently monitors adhesive levels, providing automatic alerts for replenishment, ensuring uninterrupted coating. In summary, the I.C.T SMT PCB coating machine seamlessly combines precision, automation, and smart features to meet the demands of Industry 4.0. With integration into MES systems, it provides a reliable and efficient solution for elevating PCB coating processes. The I.C.T-T550's adherence to European safety standards and CE certification underscores our commitment to safety and compliance. For further inquiries or information about additional safety standards, please contact us. Whether optimizing coating quality or enhancing factory productivity, the I.C.T-T550 marks a step into the future of intelligent manufacturing. Explore a variety of coating valves or seek guidance by reaching out to us.
Technical Library | 2022-09-25 20:03:37.0
Cracking remains the major reason of failures in multilayer ceramic capacitors (MLCCs) used in space electronics. Due to a tight quality control of space-grade components, the probability that as manufactured capacitors have cracks is relatively low, and cracking is often occurs during assembly, handling and the following testing of the systems. Majority of capacitors with cracks are revealed during the integration and testing period, but although extremely rarely, defective parts remain undetected and result in failures during the mission. Manual soldering and rework that are often used during low volume production of circuit boards for space aggravate this situation. Although failures of MLCCs are often attributed to the post-manufacturing stresses, in many cases they are due to a combination of certain deviations in the manufacturing processes that result in hidden defects in the parts and excessive stresses during assembly and use. This report gives an overview of design, manufacturing and testing processes of MLCCs focusing on elements related to cracking problems. The existing and new screening and qualification procedures and techniques are briefly described and assessed by their effectiveness in revealing cracks. The capability of different test methods to simulate stresses resulting in cracking, mechanisms of failures in capacitors with cracks, and possible methods of selecting capacitors the most robust to manual soldering stresses are discussed.
Technical Library | 2009-05-21 13:41:05.0
Failure due to board flex cracks persists as the dominant failure mode in multi-layer ceramic capacitors (MLCC). (...) This paper is intended to show the impact of temperature cycling, high-temperature life tests, and multiple bend exposures to the MLCC with this flexible termination.
Technical Library | 2009-06-02 23:53:18.0
Today the lead free soldering process is a must in commercial electronics and it is also coming more and more important in automative and industrial electronics sectors in the near future. The most common choices for lead free solders are different Tin-Solder-Copper (SAC) alloys. Processes using SAC solders cause extra stress, because of increased process temperatures, especially to the plastic materials.
Technical Library | 2011-01-13 17:37:55.0
The tin whisker failures investigated in this paper were found on functional RoHS-compliant hardware. The samples were not conformal coated. This paper will document the conditions associated with the whisker formation under the following conditions; tin
Technical Library | 2009-10-08 01:58:04.0
In the present study, we report novel ferroelectric-epoxy based polymer nanocomposites that have the potential to surpass conventional composites to produce thin film capacitors over large surface areas, having high capacitance density and low loss. Specifically, novel crack resistant and easy to handle Resin Coated Copper Capacitive (RC3) nanocomposites capable of providing bulk decoupling capacitance for a conventional power-power core, or for a three layer Voltage-Ground-Voltage type power core, is described.
Technical Library | 2021-11-03 16:36:36.0
Laser reflow soldering is an important technology in electronic components processing. In this paper, we presented a simple but efficient method to achieve reflow soldering process with gradient energy band created by just two parallel mirrors. The detailed influence of the variety of optical parameters on the soldering process has been analyzed by using the finite element method. And the modulation of the optical parameters on reflow soldering parameters also has been demonstrated. In our experiment, one HR mirror and one-mirror with transmissivity of 10% have been used to create a gradient energy band with an incident laser power of 50W. In summary, both the simulations and the experiments show that the typical reflow soldering profile has been acquired by the optical system. The high quality joints on both the front and rear surface of the capacitor can be acquired by just one surface radiation of the optical system.
Technical Library | 2016-09-08 16:27:49.0
In this investigation a test matrix was completed utilizing 900 electrodes (small circuit board with parallel copper traces on FR-4 with LPI soldermask at 6, 10 and 50 mil spacing): 12 ionic contaminants were applied in five concentrations to three different spaced electrodes with five replicas each (three different bare copper trace spacing / five replications of each with five levels of ionic concentration). The investigation was to assess the electrical response under controlled heat and humidity conditions of the known applied contamination to electrodes, using the IPC SIR (surface insulation resistance) J-STD 001 limits and determine at what level of contamination and spacing the ionic / organic residue has a failing effect on SIR.
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