Technical Library | 2022-04-29 00:49:12.0
Tools: soldering iron, soldering iron stand, wet sponge, tweezers, rosin, solder, absorbent cotton, 95% alcohol, chip resistors, capacitors, circuit boards, 220V power supply..... http://www.leadersmt.com/gen2/1028113523/?mod=file&col_key=download
Technical Library | 2022-04-28 06:42:19.0
I. Chip capacitors(MLCC) The full name of chip capacitors: multilayer (multilayer, laminated) chip ceramic capacitors, also known as chip capacitors, chip capacitance.
Technical Library | 2022-04-26 03:27:56.0
The naming of the chip capacitor: The parameters included in the name of the chip capacitor include the size of the chip capacitor, the material used for this chip capacitor, the required accuracy, the required voltage, the required capacity, the requirements of the terminal and packaging requirements. Generally, the parameters to be provided for ordering a chip capacitor should be the size, the required accuracy, the voltage requirement, the capacity value, and the required brand.
Technical Library | 2022-04-27 01:34:43.0
SMD capacitors and resistors have small sizes and many models. Some manufacturers buy a lot of products and do not use them up in time. The problem of storage is always a headache. So how should chip capacitors and resistors be stored? There are also precautions when using chip capacitors. Please see the following information and hope it will help you.
Technical Library | 2015-05-21 18:46:31.0
In this work the reliability of an embedded planar capacitor laminate under temperature and voltage stress is investigated. The capacitor laminate consisted of an epoxy-BaTiO3 composite sandwiched between two layers of copper. The test vehicle with the embedded capacitors was subjected to a temperature of 125oC and a voltage bias of 200 V for 1000 hours. Capacitance, dissipation factor, and insulation resistance were monitored in-situ. Failed capacitors exhibited a sharp drop in insulation resistance, indicating avalanche breakdown. The decrease in the capacitance after 1000 hours was no more than 8% for any of the devices monitored. The decrease in the capacitance was attributed to delamination in the embedded capacitor laminate and an increase in the spacing between the copper layers.
Technical Library | 2020-08-13 00:59:03.0
The paper will discuss the integration of 3D printing and inkjet printing fabrication technologies for microwave and millimeter-wave applications. With the recent advancements in 3D and inkjet printing technology, achieving resolution down to 50 um, it is feasible to fabricate electronic components and antennas operating in the millimeter-wave regime. The nature of additive manufacturing allows designers to create custom components and devices for specialized applications and provides an excellent and inexpensive way of prototyping electronic designs. The combination of multiple printable materials enables the vertical integration of conductive, dielectric, and semi-conductive materials which are the fundamental components of passive and active circuit elements such as inductors, capacitors, diodes, and transistors. Also, the on-demand manner of printing can eliminate the use of subtractive fabrication processes, which are necessary for conventional microfabrication processes such as photolithography, and drastically reduce the cost and material waste of fabrication.
Technical Library | 2016-06-16 15:29:31.0
Embedding components within the PC board structure is not a new concept. Until recently, however, most embedded component PC board applications adapted only passive elements. The early component forming processes relied on resistive inks and films to enable embedding of resistor and capacitors elements. Although these forming methods remain viable, many companies are choosing to place very thin discrete passive components and semiconductor die elements within the PC board layering structure. In addition to improving the products performance, companies have found that by reducing the component population on the PC board's surface, board level assembly is less complex and the PC board can be made smaller, The smaller substrate, even when more complex, often results in lower cost. Although size and cost reductions are significant attributes, the closer coupling of key elements can also contribute to improving functional performance.This paper focuses on six basic embedded component structure designs described in IPC-7092.
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