Technical Library: cent (Page 1 of 1)

Ceramic to Plastic Packaging

Technical Library | 2010-04-15 22:06:32.0

As electronic products increase in functionality and complexity, there is an emphasis on affordability, miniaturization, and energy efficiency. The telecommunications, automotive, and commercial electronic markets are the leading drivers for these trends. These markets see high volume manufacturing with millions of units priced to the fraction of the cent. The choice of the packaging material for the electrical components for these markets can have a substantial effect on the cost of the final product. Therefore plastic encapsulated components are almost universally used in non-military applications over the conventional ceramic or metal electronic packages.

Electronics Manufacturing Productivity Facility (EMPF)

  1  

cent searches for Companies, Equipment, Machines, Suppliers & Information

Blackfox IPC Training & Certification

High Throughput Reflow Oven
Void Free Reflow Soldering

Training online, at your facility, or at one of our worldwide training centers"
Thermal Interface Material Dispensing

World's Best Reflow Oven Customizable for Unique Applications
2024 Eptac IPC Certification Training Schedule

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Fully Automatic BGA Rework Station

BEST IPC Certifications and Solder Training Online!