Technical Library | 2019-05-21 00:21:26.0
Continue to talk about the dust removal from temperature humidity test chamber. Cleaning and maintenance: 1) Pls remove internal impurities inisde chamber before operation. 2) The power distribution room should be cleaned at least once a year, and the dust can be removed by vacuum cleaner. 3) The exterior chamber must also be cleaned more than once a year, which can be wiped with soapy water. Inspection and maintenance of humidifier: The water storage in humidifier should be replaced once a month to ensure clean water quality, humidifying water tray should be cleaned once a month to ensure smooth flow of water. The inspection of over-temperature protector:during the test: If the temperature is over 20 ℃ ~ 30 ℃ than the maximum value setted,the power supply of the heater will stop, the "OVERHEAT" overt-emperature warning light will automatically turn on but the fan is still in operation, if the equipment runs without operator around,the operator should check the over-temperature protector in advance to ensure wether it has been setted properly before start [wet ball over-temperature protector set to 120 ℃].
Technical Library | 2021-08-11 00:57:57.0
This paper shows the Design and Finite Element analysis of vacuum chamber of potting machine designed for electronic ignition coil applications. There are two types of potting methods 1) With Vacuum 2) Without Vacuum.
Technical Library | 2021-12-06 03:43:31.0
By potting under vacuum, components can be optimally protected from external influences. Before the potting process, air and moisture are removed from the components by vacuum. Components with geometries that are difficult to vent, coils, transformers or wound goods can be potting free of air bubbles. Potting under vacuum guarantees an even distribution of the potting material.
Technical Library | 2021-12-31 06:55:24.0
Any air entrapment in the potting compound can result in air bubbles that may cause performance problems in the finished component. Potting under vacuum is therefore frequently required to prevent air entrapment, especially with the increasingly small and complex assemblies required in today's electronics
Technical Library | 2021-12-31 06:56:02.0
Any air entrapment in the potting compound can result in air bubbles that may cause performance problems in the finished component. Potting under vacuum is therefore frequently required to prevent air entrapment, especially with the increasingly small and complex assemblies required in today's electronics
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