Technical Library | 2010-10-28 01:27:38.0
Optical waveguides based on organic materials have been fabricated in a laboratory environment but the scaling and manufacturing processes needed to produce these waveguides have been scant. The volume production of low loss organic waveguides in a conven
Technical Library | 1999-05-06 14:19:44.0
In many high-performance VLSI designs, including all recent Intel microprocessors, datapath is implemented in a bit-sliced structure to simultaneously manipulate multiple bits of data. The circuit and layout of such structures are largely kept the same for each bit slice to achieve maximal performance, higher designer productivity, and better layout density. There are very few tools available to automate the design of a general datapath structure, most of which is done manually...
Technical Library | 2010-04-15 20:42:44.0
The high level of current interest in embedded passives in printed circuit boards is driven by the tremendous pressure to pack more circuitry into smaller spaces. However, adoption has been limited due to design, prototyping and infrastructure issues, as well as the stability and tolerances necessary for widespread replacement of discretes. The focus of this work has been to develop a polymer thick film resistor technology to incorporate reliable organic resistors inside printed wiring boards using standard PWB processing.
Technical Library | 2014-06-05 16:44:07.0
Stencil printing capability is becoming more important as the range of component sizes assembled on a single board increases. Coupled with increased component density, solder paste sticking to the aperture sidewalls and bottom of the stencil can cause insufficient solder paste deposits and solder bridging. Yield improvement requires increased focus on stencil technology, printer capability, solder paste functionality and understencil cleaning.(...) The purpose of this research is to study the wipe sequence, wipe frequency and wipe solvent(s) and how these factors interact to provide solder paste printing yield improvement.
Technical Library | 2016-11-03 17:53:56.0
We present a novel method for fabricating a high-density carbon nanotube microelectrode array (MEA) chip. Vertically aligned carbon nanotubes (VACNTs) were synthesized by microwave plasma-enhanced chemical vapor deposition and thermal chemical vapor deposition. The device was characterized using electrochemical experiments such as cyclic voltammetry, impedance spectroscopy and potential transient measurements. Through-silicon vias (TSVs) were fabricated and partially filled with polycrystalline silicon to allow electrical connection from the high-density electrodes to a stimulator microchip.In response to the demand for higher resolution implants, we have developed a unique process to obtain a high-density electrode array by making the microelectrodes smaller in size and designing new ways of routing the electrodes to current sources.
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