Technical Library: chrys shea thermocouple (Page 1 of 2)

Evaluation of Stencil Foil Materials, Suppliers and Coatings

Technical Library | 2011-12-08 17:46:42.0

The past few years have brought PCB assemblers a multitude of choices for SMT stencil materials and coatings. In addition to the traditional laser-cut stainless steel (SS) or electroformed nickel, choices now include SS that has been optimized for laser c

Shea Engineering Services

The Characterization and Comparison of Spray Fluxers

Technical Library | 1999-04-26 11:52:34.0

An evaluation of two fluxers, one with a reciprocating ultrasonic head and the other with microjets, was performed using nine independent criteria. The paper describes the methods of testing and the results.

Siemens Process Industries and Drives

VOC-Free Wave Solder Flux Evaluation

Technical Library | 1999-04-26 15:51:30.0

The goal of the flux evaluation was to identify one product that would meet the needs of all SICN's wave solder products and processes while producing high quality assemblies. At the outset of the evaluation, it was unclear whether a single flux chemistry could satisfy such a broad range of demands, particularly because SICN's utilization of less aggressive, low-impact chemicals.

Siemens Process Industries and Drives

Optimizing the Wave Soldering Process with Hot Nitrogen Knives

Technical Library | 1999-04-29 15:39:03.0

The paper describes the effects of a debridging knife on inerted soldering environments in an Electrovert Econopak wave solder machine. It reviews experiments to improve the purity of the soldering environment and results of the tests.

Siemens Process Industries and Drives

Simple, Effective Process Control in Wave Soldering

Technical Library | 1999-06-23 20:29:21.0

This paper outlines the harmful effects of out-of-control process parameters and describes methods of measuring and tracking them to keep them in control. It addresses all critical variables of wave soldering: flux deposition, preheat application, conveyor speed, solder temperature and solder contact time.

Siemens Process Industries and Drives

Selection Of Wave Soldering Fluxes For Lead-Free Assembly

Technical Library | 2008-07-10 12:52:18.0

This paper reviews the J-STD-004 and how it is used in flux categorization and selection. It also discusses the major types of flux formulations available, and the design, process and reliability implications of using each type. The purpose of the paper is to help the reader make an informed choice when selecting wave solder fluxes for lead-free processing.

Cookson Electronics

Quantitative Evaluation of New SMT Stencil Materials

Technical Library | 2011-06-29 14:44:52.0

High yields in the stencil printing process are essential to a profitable SMT assembly operation. But as circuit complexity continues to increase, so do the challenges of maintaining a successful solder paste deposition process. To help assemblers address

Shea Engineering Services

Nanocoatings Webinar & NanoClear® Stencil Treatment

Technical Library | 2023-05-22 17:13:17.0

Agenda Overview Independent Testing & Studies-Print studies -Understencil Wipe studies-Durability Testing-Ongoing Studies NanoClear Product Information NanocoatingsComparison Summary Questions

Aculon

Fine Tuning The Stencil Manufacturing Process and Other Stencil Printing Experiments

Technical Library | 2013-11-21 12:01:11.0

Previous experimentation on a highly miniaturized and densely populated SMT assembly revealed the optimum stencil alloy and flux-repellent coating for its stencil printing process. Production implementation of the materials that were identified in the study resulted in approximately 5% print yield improvement across all assemblies throughout the operation, validating the results of the initial tests. A new set of studies was launched to focus on the materials themselves, with the purpose of optimizing their performance on the assembly line (...) Results of the prior tests are reviewed, and the new test vehicle, experimental setup and results are presented and discussed.

Shea Engineering Services

Optimizing Stencil Design For Lead-Free Smt Processing

Technical Library | 2023-06-12 19:18:24.0

As any new technology emerges, increasing levels of refinement are required to facilitate the mainstream implementation and continual improvement processes. In the case of lead-free processing, the initial hurdles of alloy and chemistry selection are cleared on the first level, providing a base process. The understanding gained from early work on the base process leads to the next level of refinement in optimizing the primary factors that influence yield. These factors may include thermal profiles, PWB surface finishes, component metallization, solder mask selection or stencil design.

Cookson Electronics Assembly Materials

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