Technical Library | 2013-11-27 16:54:01.0
The need in complexity for microwave space products such as active BFNs (Beam Forming Networks) is increasing, with a significantly growing number of amplitude / phase control points (number of beams * numbers of radiating elements). As a consequence, the RF component’s package topology is evolving (larger number of I/Os, interconnections densification ...) which directly affect the routing and architecture of the multilayer boards they are mounted on. It then becomes necessary to improve the density of these boards (...) This paper will present the work performed to achieve LCP-based high density multilayer structures, describing the different electrical and technological breadboards manufactured and tested and presenting the results obtained.
Technical Library | 2017-11-22 12:38:51.0
The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described[1] an approach to very thin copper laminates of coating uniform layers of nano copper inks and converting them into conductive foils via photonic sintering with a multibulb conveyor system, which is consistent with roll-to-roll manufacturing. The copper thickness of these foils can be augmented by electroplating. Very thin copper layers enable etching fine lines in the flexible circuit. These films must adhere tenaciously to the polyimide substrate.In this paper, we investigate the factors which improve and inhibit adhesion. It was found that the ink composition, photonic sintering conditions, substrate pretreatment, and the inclusion of layers (metal and organic) intermediate between the copper and the polyimide are important.
Technical Library | 2020-01-02 12:16:02.0
A customer contacted the Helpline with the concern that parts being used in their assembly may possibly be counterfeit components. The counterfeiting of electronics components is a world-wide problem, and the threat today is even more evident than ever before. Any company, large or small, that manufactures assemblies using electronics components is equally susceptible to using counterfeit devices in their assemblies. In most cases, counterfeit components aren't discovered until after the component has already been placed on a printed circuit board (PCB), usually during first article electrical test. At this point, the only recourse is to debug the circuit to determine the faulty component and rework each PCB already in production to replace the faulty component. As one might easily surmise, this is a rather costly process; world-wide, counterfeit components account for over $15B loss in sales annually!
Technical Library | 2024-01-15 20:45:42.0
Miniaturization continues to be a driving force in both integrated circuit packaging and printed circuit board laminate technology. In addition to decreasing component pitch (lead to lead spacing), utilization of the vertical space by stacking packages has found wide acceptance by both designers and manufactures of electronics alike. Lead free Package on Package (PoP) technology represents one of the latest advancements in vertical electronics packaging integration and has become the preferred technology for mobile hand held electronics applications. TT Electronics in Perry, Ohio has developed the capability to assemble and rework numerous "state of the art" packaging technologies. This paper will focus on the essential engineering development activities performed to demonstrate TT Electronics' ability to both assemble and rework PoP components.
Technical Library | 2024-01-16 22:29:59.0
Miniaturization continues to be a driving force in both integrated circuit packaging and printed circuit board laminate technology. In addition to decreasing component pitch (lead to lead spacing), utilization of the vertical space by stacking packages has found wide acceptance by both designers and manufactures of electronics alike. Lead free Package on Package (PoP) technology represents one of the latest advancements in vertical electronics packaging integration and has become the preferred technology for mobile hand held electronics applications. TT Electronics in Perry, Ohio has developed the capability to assemble and rework numerous "state of the art" packaging technologies. This paper will focus on the essential engineering development activities performed to demonstrate TT Electronics' ability to both assemble and rework PoP components.
Technical Library | 2021-01-21 02:04:27.0
Traditional single level microvia structures are generally considered the most robust type of interconnection within a printed wire board (PWB) substrate. The rapid implementation of HDI technology now commonly requires between 2, 3 or 4 levels of microvias sequentially processed into the product. Recent OEM funded reliability testing has confirmed that by increasing the levels (stack height) these structures are proving less reliable, when compared to their single or double level counterparts. Recently false positive results have been recorded on products tested with traditional thermal shock testing methodology (cycling between -40°C and 125°C, or 145°C). A number of companies are incurring product failures resulting in increased costs associated with replacing the circuit boards, components and added labour.
Technical Library | 2015-09-17 17:36:56.0
RoHS legislated restrictions on the materials used in electronics manufacture have imparted significant challenges on the electronics industry since their introduction in 2006. The greatest impacts have been felt by the mandated elimination of lead from electronic solder followed by the demand for the elimination of haloids from flame retardants used in traditional PCB laminates. In the years which have followed the electronics industry has been beset with a host of new challenges in its effort to comply. Failure mechanisms, both new and old, have surfaced which demand solution and the industry suppliers and manufacturing technologists have worked diligently to remedy those vexing faults through the development of a wide range of new materials and equipment for both board manufacture and assembly, along with modifications to the processes used in the manufacture and assembly of printed circuit boards.
Technical Library | 2013-08-29 19:52:43.0
Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...
Technical Library | 2013-08-15 13:12:11.0
An automated visual PCB inspection is an approach used to counter difficulties occurred in human’s manual inspection that can eliminates subjective aspects and then provides fast, quantitative, and dimensional assessments. In this study, referential approach has been implemented on template and defective PCB images to detect numerous defects on bare PCBs before etching process, since etching usually contributes most destructive defects found on PCBs. The PCB inspection system is then improved by incorporating a geometrical image registration, minimum thresholding technique and median filtering in order to solve alignment and uneven illumination problem. Finally, defect classification operation is employed in order to identify the source for six types of defects namely, missing hole, pin hole, underetch, short-circuit, mousebite, and open-circuit.
Technical Library | 2013-09-19 17:25:32.0
The next generation of smart phones will demand very thin multi-layer boards to reduce the product thickness again. This paper shows three different manufacturing approaches, which can be used for very thin any-layer build-ups. The technological approaches are compared on reliability level – the any-layer copper filled micro-via technology which is to be considered as state of the art technology for high end phones and the ALIVH-C/G technology that is well established in Japan. A test vehicle design featuring test coupons for comprehensive reliability test series has been defined as target application for investigation...
