Technical Library: coating (Page 3 of 11)

Tin Whiskers: Mitigation with Conformal Coatings | Part II

Technical Library | 2019-06-20 07:45:19.0

One of the two basic risks of employing the commercially accepted, Restriction of Hazardous Substances (RoHS) compliant, lead-free (Pb-free) electronics is the threat to the electronics reliability from the growth of tin whiskers. The other basic risk deals with Pb-free solder joint reliability.

ACI Technologies, Inc.

Identifying Flux Residues

Technical Library | 2019-05-23 10:42:00.0

Why identify flux residues? The primary purpose of flux is to reduce species of metal oxides from solderable surfaces, and to act as a mechanism for lifting and removing debris. If the assembly is not properly cleaned after manufacturing, flux may continue to reduce metals and may eventually corrode the assembly. When the assembly is powered, the metal ions may precipitate along electromagnetic field lines and form dendritic shorts. In addition, the presence of residue can alter the insulation properties of a board, affect the adhesion of the conformal coating, or interfere with the moving parts of the assembly. In radio frequency (RF) applications, flux may change the RF properties on the surface of the printed circuit board (PCB) such as the dielectric strength, surface resistance, and Q-resonance.

ACI Technologies, Inc.

Made in Japan: Solder Paste Jet Dispensing Machine

Technical Library | 2024-03-19 07:58:40.0

Introduction of Solder Paste Jet Dispensing Machine Step into the future of manufacturing with the Solder Paste Jet Dispensing Machine, meticulously crafted in Japan under the esteemed I.C.T brand. This cutting-edge equipment represents the pinnacle of precision engineering, delivering unrivaled performance and reliability. Let's dive into its exceptional features and applications. Transmission Structure System of Solder Paste Jet Dispensing Machine At the heart of this Solder Paste Jet Dispensing Machine lies a meticulously designed transmission structure system. Powered by X Y linear motor drive control, it achieves unprecedented precision in positioning. With a reciprocating position accuracy of 3σ±5um and a dynamic position accuracy of 3σ±3um across the X, Y, and Z axes, it ensures flawless execution of tasks with minimal deviation. The load-type gantry structure further enhances stability and accuracy, guaranteeing consistent performance even during high-speed operations. Advanced Function Configuration Flexibility and customization are the hallmarks of the Solder Paste Jet Dispensing Machine. It features a customizable platform tailored to meet the specific needs of diverse applications, ensuring optimal performance and efficiency. Additionally, the machine boasts advanced functionalities such as automatic correction of substrate warp height and real-time penetration monitoring. Equipped with dual cameras, it provides precise feedback for adjustments during the filling process, ensuring unmatched precision and quality. Function configuration.jpg Vision Non-stop Experience uninterrupted precision with the Vision Non-stop functionality of this machine. Capable of detecting 100 chips per second, it automatically identifies position and height deviations, enabling real-time compensation for coating actions. Dual compensation for path and glue amount further optimizes efficiency, minimizing waste and maximizing productivity. With its ability to print solder paste dots as small as 110um, it's perfectly suited for high-precision applications in ICs, BGAs, and beyond. Versatility in Configuration Options and Applications Adaptability is key in modern manufacturing, and the Solder Paste Jet Dispensing Machine delivers on all fronts. Offering a range of configuration options, including different valves tailored to various material viscosities and fluidity, it ensures optimal performance across diverse production scenarios. From semiconductor packages to LED back-end Mini-LED production, its versatility knows no bounds, making it an indispensable asset in a wide range of industries. Explore the Future of Manufacturing with I.C.T Join the ranks of industry leaders embracing the future of manufacturing with I.C.T's Solder Paste Jet Dispensing Machine. With its unrivaled precision, speed, and reliability, it's set to revolutionize your production processes and propel your business to new heights of success. Don't just keep up with the competition--surpass it with I.C.T's cutting-edge solutions. Unlock the Potential of Precision Manufacturing Delve deeper into the transformative power of precision manufacturing and discover how the Solder Paste Jet Dispensing Machine can unlock new possibilities for your business. From reducing production costs to improving product quality, the benefits are endless. Partner with I.C.T today and embark on a journey towards manufacturing excellence. Conclusion In conclusion, our Solder Paste Jet Dispensing Machine embodies the fusion of Japanese precision and I.C.T reliability, offering unparalleled efficiency in solder paste dispensing. With its advanced features and customizable options, it caters to the diverse needs of modern manufacturing processes. Experience the pinnacle of dispensing technology with our Solder Paste Jet Dispensing Machine. Overseas Technical Support by I.C.T At I.C.T, our commitment to customer satisfaction extends beyond the initial purchase. We provide comprehensive overseas technical support, including machine installation, debugging, and customer training. Our dedicated team ensures that your production line runs smoothly from the first product off the line to the seamless delivery of the machine. Partner with I.C.T today and elevate your manufacturing precision with our Solder Paste Jet Dispensing Machine. Contact us now to learn more about our solutions and take your production processes to new heights of efficiency and reliability.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Is coating adhesion a problem?

Technical Library | 2016-11-09 19:22:54.0

Nordson MARCH found a solution for a manufacturer of PCBAs used in ruggedized environments. Read how plasma prior to conformal coating reduced defects and virtually eliminated coating-related failures.

MARCH Products | Nordson Electronics Solutions

PCB Conformal Coatings Guide - II

Technical Library | 2016-10-07 07:28:12.0

In the previous post, we discussed the importance of conformal coatings, materials used for coatings, and methods of application. In this post, we shall look at various conformal coating curing methods, and analyze their immediate benefits.

Sierra Assembly Technology LLC

Successful Conformal Coating Masking

Technical Library | 2013-10-22 07:38:42.0

In conformal coating many components and printed circuit board locations must remain uncoated due to the insulating nature of the coating. The purpose of the conformal coating masking materials is to prevent migration of the conformal coatings into components that need to clear and designated keep out areas. This applies to both liquid conformal coating and Parylene processing. Get this basic process wrong and it can be a big problem, leading to the next stage of either repairing the conformal coating leak, stripping the conformal coating off the circuit board, removing a component to replace it or scrapping the board. This paper reviews typical masking application methods in conformal coating and provides advice on minimising problems.

SCH Technologies

Conformal Coating Thickness Measurement

Technical Library | 2013-10-13 10:54:13.0

The measurement of the conformal coating thickness on a printed circuit board (PCB) to ensure internal and international standards are met is now a critical factor in conformal coating process control. There are several methods for measurement of conformal coating thickness and they fall into two categories. These categories are wet film measurements applied during coating application and dry film measurements made after the coating is dried enough not to damage the coating.

SCH Technologies

Measuring Conformal Coating Thickness

Technical Library | 2015-07-21 13:50:37.0

Achieving an even coat at the right desired thickness is a major challenge when it comes to applying conformal coating to a Printed Circuit Board (PCB). Applying a coating too thin will ultimately render the electronic assembly vulnerable to potential environmental risks therefore defeating the purpose of the coating. Apply the coat too thick, and it could leave the electronic specific components non-functional therefore destroying the electronic assembly entirely. Coating thickness must meet quality specifications. Measurements for coating thickness may be taken while film is dry or wet. Once measurements are recorded, thickness is compared to quality specifications and fluid dispensing automation machinery is calibrated as necessary. There are a handful of methods for measuring conformal coating thickness that are commonly used in the Electronic Manufacturing Services (EMS) and Original Electronic Manufacturer (OEM) industries. A few commonly used methods for checking conformal coating thickness include:

ETS - Energy Technology Systems, Inc.

Reduce labor by automating your Selective Conformal Coating process

Technical Library | 2015-06-22 18:31:52.0

Applying conformal coatings to electronics has come a long way since the days of manually coating circuit boards. The extreme accuracy and highly repetitive process of automated conformal coatings is moving the electronics industry towards a more defect-free era for conformal coating. It enables new forms of electronics to become better protected, making it possible for electronics to withstand harsher environments than ever before. The following article is meant to aid in clarifying the advantages of specialty coating systems over manual applications for selective conformal coating.

ETS - Energy Technology Systems, Inc.

Characteristics of Conformal Coatings

Technical Library | 2007-08-28 20:18:06.0

A conformal coating is defined as a thin polymeric material which covers the surface of an electronic assembly. These coatings are used to provide an electrically insulative and environmentally protective seal or cover to a completed printed circuit board (PCB).

Electronics Manufacturing Productivity Facility (EMPF)


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